Datasheet > TSP840M

TSP840M

更新时间： 2024-11-18 17:15:39

品牌	Logo	应用领域
信安 - TRUESEMI		/
页数	文件大小	规格书
9页	387K
描述
TO-220

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中文翻译

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TSP840M 数据手册

TSP840M/TSF840M

500V N-Channel MOSFET

General Description

Features

This Power MOSFET is produced using Truesemi‘s

• 9.0A,500V,Max.R_DS(on)=0.80 Ω @ V_GS=10V

• Low gate charge(typical 30nC)

• High ruggedness

• Fast switching

• 100% avalanche tested

• Improved dv/dt capability

advanced planar stripe DMOS technology.

This advanced technology has been especially tailored to

minimize on-state resistance, provide superior switching

performance, and withstand high energy pulse in the

avalanche and commutation mode. These devices are well

suited for high efficiency switched mode power supplies,

active power factor correction based on half bridge

topology.

Absolute Maximum Ratings

T_J=25℃ unless otherwise specified

Symbol

V_DSS

Parameter

TSP840M

TSF840M

Units

Drain-Source Voltage

Gate-Source Voltage

500

V_GS

±30

T_C= 25℃

T_C= 100℃

(Note 1)

(Note 2)

(Note 1)

(Note 3)

9.0

5.4

9.0*

5.4*

36*

I_D

Drain Current

I_DM

E_AS

Pulsed Drain Current

Single Pulsed Avalanche Energy

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

360

13.9

4.5

V/ns

E_AR

dv/dt

139

45.5

0.36

Power Dissipation (T_C= 25℃)

-Derate above 25℃

P_D

T_J, T_STG

T_L

1.11

W/℃

℃

Operating and Storage Temperature Range

-55 to +150

Maximum lead temperature for soldering purposes,

300

℃

1/8” from case for 5 seconds

* Drain current limited by maximum junction temperature.

Thermal Resistance Characteristics

Symbol

Parameter

TSP840M

TSF840M

Units

℃/W

R_θJC

Thermal Resistance,Junction-to-Case

Thermal Resistance,Case-to-Sink Typ.

0.90

0.5

2.75

R_θCS

R_θJA

Thermal Resistance,Junction-to-Ambient

62.5

Ver.B1

www.truesemi.com

12 3 4 5 6 7...9

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