TSK9N90M
900V N-Channel MOSFET
General Description
Features
This Power MOSFET is produced using Truesemi‘s
• 9.0A,900V,Max.RDS(on)=1.40Ω @ VGS =10V
• Low gate charge(typical 52nC)
• High ruggedness
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
advanced planar stripe DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction based on half bridge
topology.
TO-247
Absolute Maximum Ratings
TC=25℃ unless otherwise specified
Symbol
VDSS
Parameter
Value
Units
V
Drain-Source Voltage
Gate-Source Voltage
900
VGS
30
V
±
TC = 25℃
TC = 100℃
(Note 1)
(Note 2)
(Note 1)
(Note 3)
9.0
A
ID
Drain Current
5.7
36
A
IDM
EAS
Pulsed Drain Current
A
Single Pulsed Avalanche Energy
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (TC = 25℃)
900
mJ
mJ
V/ns
W
EAR
28
dv/dt
PD
4.0
130
TJ, TSTG
Operating and Storage Temperature Range
-55 to +150
℃
Maximum lead temperature for soldering purposes,
TL
300
℃
1/8” from case for 5 seconds
Thermal Resistance Characteristics
Symbol
Parameter
Typ.
Max.
Units
℃/W
℃/W
℃/W
RθJC
Thermal Resistance,Junction-to-Case
--
0.24
--
0.45
Thermal Resistance,Case-to-Sink Typ.
Thermal Resistance,Junction-to-Ambient
--
RθCS
RθJA
40
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Ver.B1
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