TSF4N65F
650V N-Channel MOSFET
preliminary
General Description
Features
This Power MOSFET is produced using Truesemi‘s
advanced planar stripe DMOS technology.
• 4A,650V,Max.RDS(on)=3.8 Ω @ VGS =10V
• Low gate charge(typical 8.5nC)
• High ruggedness
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction based on half bridge
topology.
G
D
S
TO-220F
Absolute Maximum Ratings
TC=25℃ unless otherwise specified
Symbol
VDSS
Parameter
Value
600
Units
V
Drain-Source Voltage
Gate-Source Voltage
VGS
V
± 30
4*
TC = 25℃
TC = 100℃
(Note 1)
(Note 2)
(Note 1)
(Note 3)
A
ID
Drain Current
A
2.5*
IDM
EAS
Pulsed Drain Current
A
16*
Single Pulsed Avalanche Energy
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
mJ
mJ
V/ns
W
70
EAR
6.2
dv/dt
4.5
35
Power Dissipation (TC = 25℃)
-Derate above 25℃
PD
TJ, TSTG
TL
W/℃
℃
0.28
-55 to +150
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
℃
300
* Drain current limited by maximum junction temperature.
Thermal Resistance Characteristics
Symbol
Parameter
Typ
Max
3.6
Units
RθJC
Thermal Resistance,Junction-to-Case
--
--
℃/W
Thermal Resistance,Junction-to-Ambient
62.5
℃/W
RθJA
© 2017 Truesemi Semiconductor Corporation
Ver.B1
www.truesemi.com