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TSF4N60F PDF预览

TSF4N60F

更新时间: 2024-09-25 17:15:19
品牌 Logo 应用领域
信安 - TRUESEMI /
页数 文件大小 规格书
7页 495K
描述
TO-220F

TSF4N60F 数据手册

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TSF4N60F  
600V N-Channel MOSFET  
preliminary  
General Description  
Features  
This Power MOSFET is produced using Truesemi‘s  
advanced planar stripe DMOS technology.  
• 4A,600V,Max.RDS(on)=3.2 Ω @ VGS =10V  
• Low gate charge(typical 8.5nC)  
• High ruggedness  
• Fast switching  
• 100% avalanche tested  
• Improved dv/dt capability  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction based on half bridge  
topology.  
G
D
S
TO-220F  
Absolute Maximum Ratings  
TC=25unless otherwise specified  
Symbol  
VDSS  
Parameter  
Value  
600  
Units  
V
Drain-Source Voltage  
Gate-Source Voltage  
VGS  
V
± 30  
4*  
TC = 25  
TC = 100℃  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 3)  
A
ID  
Drain Current  
A
2.5*  
IDM  
EAS  
Pulsed Drain Current  
A
16*  
Single Pulsed Avalanche Energy  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
mJ  
V/ns  
W
70  
EAR  
3.5  
dv/dt  
4.5  
35  
Power Dissipation (TC = 25)  
-Derate above 25℃  
PD  
TJ, TSTG  
TL  
W/℃  
0.28  
-55 to +150  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
1/8” from case for 5 seconds  
300  
* Drain current limited by maximum junction temperature.  
Thermal Resistance Characteristics  
Symbol  
Parameter  
Typ  
Max  
3.6  
Units  
RθJC  
Thermal Resistance,Junction-to-Case  
--  
--  
/W  
Thermal Resistance,Junction-to-Ambient  
62.5  
/W  
RθJA  
© 2017 Truesemi Semiconductor Corporation  
Ver.B1  
www.truesemi.com  

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