TS3V712E
www.ti.com
SCDS292 –JANUARY 2010
7-CHANNEL VIDEO SWITCH
Check for Samples: TS3V712E
1
FEATURES
•
32-Pin Quad Flat Pack No-Lead QFN(RTG)
Package
•
High Bandwidth (BW = 1.36 GHz)
•
Designed for 7-Channel VGA Signals (R,G,B,
Hsync, Vsync, DDC Dat, and DDC CLK)
APPLICATIONS
•
Notebook Computers
•
Separate Control Logic for Data and Control
Signals
•
Analog VGA Peripheral Ports
•
•
Operating Voltage: 3.3 V ±10%
RTG PACKAGE
(TOP VIEW)
Low and Flat ON-State Resistance
–
–
rON = 3 Ω
rON(flat) = 500 mΩ
•
•
Low Crosstalk (XTALK = –49.76 dB Typ at 250
MHz)
B0
C0
B1
C1
VDD
B2
C2
B3
C3
B4
C4
A0
A1
Low Input/Output Capacitance
GND
VDD
A2
–
CON = 7 pF, Typ
•
ESD Performance Tested
A3
A4
–
–
–
4-kV IEC61000-4-2, Contact Discharge on
Switch IOs
SEL1
A5
A6
3-kV Human Body Model Per
JESD22-A114E
GND
6-kV Human Body Model (Switch Pins to
GND)
•
Suitable for Both RGB and Composite-Video
Switching
The exposed center pad must be
connected to GND.
DESCRIPTION/ORDERING INFORMATION
The TS3V712E is a high-bandwidth, 7-channel video multiplexer/demultiplexer for switching between multiple
VGA sources or end points. The device is designed for ensuring video signal integrity and minimizing the video
signal attenuation by providing high bandwidth of 1.36 GHz.
The video signals are protected against high ESD with integrated diodes to VDD and GND that will support up to
6-kV of ESD HBM and 4-kV contact protection.
The TS3V712E is available in a 32-pin QFN package and is characterized for operation over the free-air
temperature range of –40°C to 85°C.
ORDERING INFORMATION
TA
PACKAGE(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TF712E
–40°C to 85°C
QFN – RTG
Tape and reel
TS3V712ERTGR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.