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TS3USB30_08 PDF预览

TS3USB30_08

更新时间: 2024-11-25 07:04:59
品牌 Logo 应用领域
德州仪器 - TI 解复用器开关
页数 文件大小 规格书
18页 771K
描述
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

TS3USB30_08 数据手册

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TS3USB30  
www.ti.com ......................................................................................................................................................... SCDS237DAUGUST 2007REVISED MAY 2008  
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH  
WITH SINGLE ENABLE  
1
FEATURES  
RSW PACKAGE  
(TOP VIEW)  
VCC Operation at 3 V and 4.3 V  
1.8-V Compatible Control-Pin Inputs  
IOFF Supports Partial Power-Down-Mode  
Operation  
7
6
8
9
5
4
3
D–  
OE  
ron = 10 Max  
Δron <0.35 Typ  
VCC  
GND  
D+  
Cio(ON) = 7 pF Typ  
10  
S
1
2
Low Power Consumption (1 µA Max)  
ESD Performance Tested Per JESD 22  
6000-V Human-Body Model (HBM)  
(A114-B, Class II)  
RSW PACKAGE  
(BOTTOM VIEW)  
1000-V Charged-Device Model (C101)  
250-V Machine Model (A115-A)  
–3-dB Bandwidth = 955 MHz Typ  
Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)  
1
2
10  
9
3
D+  
S
APPLICATIONS  
VCC  
4
5
GND  
D–  
Routes Signals for USB 1.0, 1.1, and 2.0  
Mobile Industry Processor Interface (MIPI)  
Signal Routing  
8
OE  
7
6
DESCRIPTION/ORDERING INFORMATION  
The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in  
handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers  
with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge  
and phase distortion. The device multiplexes differential outputs from a USB host device to one of two  
corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at  
the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible  
with various standards, such as high-speed USB 2.0 (480 Mbps).  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
L6O  
–40°C to 85°C  
TQFN – RSW  
Tape and reel  
TS3USB30RSWR  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007–2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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