是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | TQFN-56 | 针数: | 56 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.24 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | SPDT | 标称带宽: | 1100 MHz |
最大输入电压: | 5.5 V | 最小输入电压: | |
JESD-30 代码: | R-PQCC-N56 | JESD-609代码: | e4 |
长度: | 11 mm | 湿度敏感等级: | 1 |
信道数量: | 11 | 功能数量: | 8 |
端子数量: | 56 | 标称断态隔离度: | 37 dB |
通态电阻匹配规范: | 0.4 Ω | 最大通态电阻 (Ron): | 1 Ω |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
输出: | SEPARATE OUTPUT | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装等效代码: | LCC56,.19X.43,20 |
封装形状: | RECTANGULAR | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 0.75 mm |
最大信号电流: | 0.128 A | 子类别: | Multiplexer or Switches |
最大供电电流 (Isup): | 500 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 最长断开时间: | 9 ns |
最长接通时间: | 15 ns | 切换: | BREAK-BEFORE-MAKE |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TS3L500RHURG4 | TI |
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