TS272MBD

更新时间： 2024-11-22 22:42:03

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		运算放大器
页数	文件大小	规格书
9页	209K
描述
HIGH SPEED CMOS DUAL OPERATIONAL AMPLIFIERS

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中文翻译

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数据手册

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TS272MBD 数据手册

TS272C,I,M

HIGH PERFORMANCE

CMOS DUAL OPERATIONAL AMPLIFIERS

■ OUTPUT VOLTAGE CAN SWING TO

GROUND

■ EXCELLENT PHASE MARGIN ON

CAPACITIVE LOADS

■ GAIN BANDWIDTH PRODUCT: 3.5MHz

■ STABLE AND LOW OFFSET VOLTAGE

DIP8

(Plastic Package)

■ THREE INPUT OFFSET VOLTAGE

SELECTIONS

DESCRIPTION

SO8

The TS272 devices are low cost, dual operational

amplifiers designed to operate with single or dual

supplies. These operational amplifiers use the ST

silicon gate CMOS process allowing an excellent

consumption-speed ratio. These series are ideally

suited for low consumption applications.

(Plastic Micropackage)

Three power consumptions are available allowing

to have always the best consumption-speed ratio:

TSSOP8

(Thin Shrink Small Outline Package)

❑ I = 10µA/amp.: TS27L2 (very low power)

PIN CONNECTIONS (top view)

❑ I = 150µA/amp.: TS27M2 (low power)

❑ I = 1mA/amp.: TS272 (standard)

These CMOS amplifiers offer very high input im-

pedance and extremely low input currents. The

major advantage versus JFET devices is the very

low input currents drift with temperature (see fig-

ure 2).

ORDER CODE

Package

Part Number

Temperature Range

1 - Output 1

2 - Inverting Input 1

TS272C/AC/BC

TS272I/AI/BI

0°C, +70°C

-40°C, +125°C

-55°C, +125°C

•

3 - Non-inverting Input 1

4 - V

TS272M/AM/BM

5 - Non-inverting Input 2

6 - Inverting Input 2

7 - Output 2

Example : TS272ACN

8 - V _CC

N = Dual in Line Package (DIP)

D = Small Outline Package (SO) - also available in Tape & Reel (DT)

P = Thin Shrink Small Outline Package (TSSOP) - only available

in Tape & Reel (PT)

November 2001

1/9

12 3 4 5 6 7...9

中文翻译

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