生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LBGA, | 针数: | 240 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.14 | JESD-30 代码: | S-PBGA-B240 |
长度: | 25 mm | 负电源额定电压: | -5 V |
功能数量: | 1 | 端子数量: | 240 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE |
认证状态: | Not Qualified | 座面最大高度: | 1.65 mm |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | BIPOLAR | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 25 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TS(X)8387MF | ATMEL |
获取价格 |
暂无描述 | |
TS(X)8387MFB/C | ATMEL |
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ADC, Proprietary Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, Bipolar, CQFP6 | |
TS(X)8387MFDSSC/SMD | ATMEL |
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ADC, Proprietary Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, Bipolar, CQFP6 | |
TS(X)PC2605MGB/C66 | ATMEL |
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Microprocessor Circuit, BICMOS, CBGA241, CERAMIC, BGA-241 | |
TS(X)PC2605MGB/T66 | ATMEL |
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Microprocessor Circuit, BICMOS, CBGA241, CERAMIC, BGA-241 | |
TS(X)PC2605VGU/T66 | ATMEL |
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Cache Tag SRAM Module, BICMOS, CBGA241, CBGA, 241 PINS | |
TS(X)PC2605VZP66 | ATMEL |
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Cache Tag SRAM Module, BICMOS, PBGA241, PLASTIC, BGA-241 | |
TS(X)PC2605VZPU/T66 | ATMEL |
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Microprocessor Circuit, BICMOS, PBGA241, PLASTIC, BGA-241 | |
TS(X)PC603EMA2LL | ATMEL |
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RISC Microprocessor, 32-Bit, 80MHz, CMOS, CQFP240, CERAMIC, QFP-240 | |
TS(X)PC603EMA2LN | ATMEL |
获取价格 |
RISC Microprocessor, 32-Bit, 80MHz, CMOS, CQFP240, CERAMIC, QFP-240 |