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TRF1020PFB PDF预览

TRF1020PFB

更新时间: 2024-02-23 19:31:24
品牌 Logo 应用领域
德州仪器 - TI 电信集成电路接收机GSM
页数 文件大小 规格书
26页 451K
描述
GSM RECEIVER

TRF1020PFB 数据手册

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TRF1020  
GSM RECEIVER  
SLWS028B – MAY 1998 – REVISED SEPTEMBER 1998  
Operates from 2.75 V to 3.5 V Supply  
Low Current Consumption  
Independent Powerdown of Low Noise  
Amplifiers (LNA), Mixers, Intermediate  
Frequency (IF) Amplifiers, and  
Low Profile Package: 48-pin Plastic Quad  
Flat Package (PQFP)  
Voltage-Controlled Oscillator (VCO)  
Digital Gain Control for LNA and IF  
Amplifiers  
Global System for Mobile Communications  
(GSM), Class 3, 4, or 5 Mobile Station (MS)  
Portable Cellular Telephone Applications  
Two IF Amplifiers for Dual Conversion if  
Required  
Conversion from Radio Frequency (RF) to  
I and Q Baseband on a Single Chip  
Cascaded Operation of IF Amplifiers for  
Single-Conversion Configurations  
DC Compensation of I and Q Outputs  
description  
The TRF1020 is a single-chip radio frequency (RF) downconverter suitable for 900-MHz GSM applications. It  
combines in one small package an LNA, an RF mixer, an IF mixer, two IF amplifiers, an I and Q mixer, and one  
buffered VCO. The TRF1020 requires few external components.  
The LNA has a nominal gain of 12.4 dB and noise figure of 2.1 dB. The first RF mixer has a conversion gain  
of 13.4 dB and a single-sideband (SSB) noise figure of 8.3 dB. The IF amplifiers have combined variable gain  
from 0 to 84 dB in approximately 3-dB steps. The IF amplifier frequency range is 40 to 180 MHz for the first IF  
amplifier and 10 to 180 MHz for the second IF amplifier. The local oscillator of the I and Q mixer operates at four  
times the last frequency of the IF mixer.  
Power consumption is kept to a minimum and can be further reduced by dynamically placing selected functions  
in standby power-down mode when not required. Power-down control is provided through the three-line digital  
serial interface.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the gates.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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