TQP5525
High Power 5 GHz WLAN Power Amplifier
Applications
• 802.11a/n/ac Wireless LAN Systems
• CPE (Set Top Box, Routers, Gateways)
• WiFi Access Points and Small Cells
• Telematics
• Gaming and Infotainment
• Point-to-point and Backhaul
• ISM Band
4x4ꢀmm 20-pin Leadless QFN Package
Product Features
Functional Block Diagram
Pin 1 Reference Mark
• Fully Integrated 802.11ac Power Amplifier Module
With Power Detector
20
19
18
17
16
• Internally Matched Inputꢀ/ꢀOutput
• Temperature Compensated Bias Network
• High Gainꢀ=ꢀ32ꢀdB
1
2
15
GND
NC
DC Biasing/
Control Circuit
14 GND
GND
• Integrated CMOS Compatible Logic and Shutdown
• Typ. POUT=+25 dBm Pout, 35 dB EVM,
13
12
11
RFOUT
GND
3
RFIN
MCS9/VHT80 802.11ac
4
5
GND
• Typ. POUT=+18 dBm, EVM=−40 dB,
PA_EN
MCS9/VHT80 802.11ac
GND
6
7
8
9
10
• Typ. POUTꢀ=ꢀ+26 dBm, EVMꢀ= −30 dB,
MCS7/HT40 802.11n
Backside Paddle
RF/DC GND
• Supply Voltage: +3.3 V to +5.0 V
• Leadless 4.0ꢀxꢀ4.0ꢀxꢀ0.85 mm Pb-Free QFN Package
General Description
Pin Configuration
The TQP5525 is high power WLAN power amplifier
module containing an internally matched 3-stage PA,
compensated DC biasing circuit and output power
detector. This PA module provides high gain (32ꢀdB),
high linearity, industry leading EVM floor, and excellent
spectral purity for wideband OFDM applications. The
architecture and interface are optimized for the most
stringent EVM requirements of next generation
802.11.ac WLAN devices.
Pin No.
2,ꢀ4,ꢀ11,ꢀ12,ꢀ14,ꢀ15,ꢀ16,ꢀ17
Label
GND
3
RFIN
PA_EN
NC
5
1, 6, 8
7
DET_ALT
VCC3
9, 18
10
DET
13
RFOUT
The TQP5525 features chipset logic compatible control
voltages and buffered PA enable pin (PAEN) all of which
draw very low current to facilitate ease of use and
compatibility with current and future transceiver
generations. With its optimized power dissipation, this
amplifier module is well suited for implementation into
next generation MIMO configurations and well designed
to work with or without digital pre-distortion (DPD).
19 / 20
VCC2 / VCC1
RF/DC Ground
Backside Paddle
Ordering Information
Part No.
TQP5525
Description
High Power 5 GHz WLAN PA
Evaluation Board
TQP5525-EVB
The TQP5525 is assembled in a small footprint 4.0 x 4.0
x 0.85 mm 20-pin QFN package.
Standard T/R size = 2500 pieces on 13” reel
Datasheet: Rev. E 01-04-15
Disclaimer: Subject to change without notice
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www.triquint.com