Datasheet > TQP5525

TQP5525

更新时间： 2024-11-29 01:13:15

品牌	Logo	应用领域
TRIQUINT		局域网 WLAN 无线局域网
页数	文件大小	规格书
9页	748K
描述
High Power 5 GHz WLAN Power Amplifier

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

TQP5525 数据手册

TQP5525

High Power 5 GHz WLAN Power Amplifier

Applications

• 802.11a/n/ac Wireless LAN Systems

• CPE (Set Top Box, Routers, Gateways)

• WiFi Access Points and Small Cells

• Telematics

• Gaming and Infotainment

• Point-to-point and Backhaul

• ISM Band

4x4ꢀmm 20-pin Leadless QFN Package

Product Features

Functional Block Diagram

Pin 1 Reference Mark

• Fully Integrated 802.11ac Power Amplifier Module

With Power Detector

• Internally Matched Inputꢀ/ꢀOutput

• Temperature Compensated Bias Network

• High Gainꢀ=ꢀ32ꢀdB

GND

DC Biasing/

Control Circuit

14 GND

GND

• Integrated CMOS Compatible Logic and Shutdown

• Typ. P_OUT=+25 dBm Pout, 35 dB EVM,

RFOUT

GND

RFIN

MCS9/VHT80 802.11ac

GND

• Typ. P_OUT=+18 dBm, EVM=−40 dB,

PA_EN

MCS9/VHT80 802.11ac

GND

• Typ. P_OUTꢀ=ꢀ+26 dBm, EVMꢀ= −30 dB,

MCS7/HT40 802.11n

Backside Paddle

RF/DC GND

• Supply Voltage: +3.3 V to +5.0 V

• Leadless 4.0ꢀxꢀ4.0ꢀxꢀ0.85 mm Pb-Free QFN Package

General Description

Pin Configuration

The TQP5525 is high power WLAN power amplifier

module containing an internally matched 3-stage PA,

compensated DC biasing circuit and output power

detector. This PA module provides high gain (32ꢀdB),

high linearity, industry leading EVM floor, and excellent

spectral purity for wideband OFDM applications. The

architecture and interface are optimized for the most

stringent EVM requirements of next generation

802.11.ac WLAN devices.

Pin No.

2,ꢀ4,ꢀ11,ꢀ12,ꢀ14,ꢀ15,ꢀ16,ꢀ17

Label

GND

RFIN

PA_EN

1, 6, 8

DET_ALT

VCC3

9, 18

DET

RFOUT

The TQP5525 features chipset logic compatible control

voltages and buffered PA enable pin (PAEN) all of which

draw very low current to facilitate ease of use and

compatibility with current and future transceiver

generations. With its optimized power dissipation, this

amplifier module is well suited for implementation into

next generation MIMO configurations and well designed

to work with or without digital pre-distortion (DPD).

19 / 20

VCC2 / VCC1

RF/DC Ground

Backside Paddle

Ordering Information

Part No.

TQP5525

Description

High Power 5 GHz WLAN PA

Evaluation Board

TQP5525-EVB

The TQP5525 is assembled in a small footprint 4.0 x 4.0

x 0.85 mm 20-pin QFN package.

Standard T/R size = 2500 pieces on 13” reel

Datasheet: Rev. E 01-04-15

Disclaimer: Subject to change without notice

- 1 of 9 -

www.triquint.com

12 3 4 5 6 7...9

中文翻译

下载PDF

与TQP5525相关器件

型号	品牌	获取价格	描述	数据表
TQP5525_15	TRIQUINT	获取价格	High Power 5 GHz WLAN Power Amplifier
TQP5525-EVB	TRIQUINT	获取价格	High Power 5 GHz WLAN Power Amplifier
TQP569022	TRIQUINT	获取价格	1.7-2.2 GHz High IP3 Dual Channel Downconverter
TQP569022_15	TRIQUINT	获取价格	1.7-2.2 GHz High IP3 Dual Channel Downconverter
TQP569022-PCB	TRIQUINT	获取价格	1.7-2.2 GHz High IP3 Dual Channel Downconverter
TQP6M9002	TRIQUINT	获取价格	802.11b/g/n WLAN/BT Front-End Module
TQP6M9017	TRIQUINT	获取价格	802.11b/g/n WLAN/BT High Performance Front-End Module
TQP770001	TRIQUINT	获取价格	Bluetooth Two Stage (HBT) Power Amplifier (EDR Compliant)
TQP777002	TRIQUINT	获取价格	2.4GHz ISM Band InGaP HBT Matched Power Amplifier
TQP787011	TRIQUINT	获取价格	802.11a 5GHz WLAN Power Amplifier

与TQP5525相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

47
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

35
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

65
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

61

产品中心

服务支持

精选活动

关于我们

帮助中心

TQP5525

TQP5525 数据手册

与TQP5525相关器件

与TQP5525相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TQP5525

TQP5525 数据手册

与TQP5525相关器件

与TQP5525相关文章

您还可以找

您在本页遇到什么问题？