TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012
600-mA, HIGH-EFFICIENCY MicroSiP™ STEP-DOWN CONVERTER (PROFILE <1.0mm)
Check for
Samples: TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676, TPS82677, TPS826711, TPS826745,
TPS826765
1
FEATURES
DESCRIPTION
23
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90% Efficiency at 5.5MHz Operation
17μA Quiescent Current
The TPS8267x device is a complete 600mA, DC/DC
step-down power supply intended for low-power
applications. Included in the package are the
switching regulator, inductor and input/output
capacitors. No additional components are required to
finish the design.
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Wide VIN Range From 2.3V to 4.8V
5.5MHz Regulated Frequency Operation
Spread Spectrum, PWM Frequency Dithering
Best in Class Load and Line Transient
±2% Total DC Voltage Accuracy
The TPS8267x is based on
synchronous step-down dc-dc converter optimized for
a high-frequency
battery-powered
portable
applications.
The
Automatic PFM/PWM Mode Switching
Low Ripple Light-Load PFM Mode
≥35dB VIN PSRR (1kHz to 10kHz)
Internal Soft Start, 120-µs Start-Up Time
MicroSiPTM DC/DC converter operates at a regulated
5.5-MHz switching frequency and enters the power-
save mode operation at light load currents to maintain
high efficiency over the entire load current range.
Integrated Active Power-Down Sequencing
(Optional)
The PFM mode extends the battery life by reducing
the quiescent current to 17μA (typ) during light load
operation. For noise-sensitive applications, the device
has PWM spread spectrum capability providing a
lower noise regulated output, as well as low noise at
the input. These features, combined with high PSRR
and AC load regulation performance, make this
device suitable to replace a linear regulator to obtain
better power conversion efficiency.
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Current Overload and Thermal Shutdown
Protection
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Sub 1-mm Profile Solution
Total Solution Size <6.7 mm2
APPLICATIONS
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Cell Phones, Smart-Phones
The TPS8267x is packaged in a compact (2.3mm x
2.9mm) and low profile (1.0mm) BGA package
suitable for automated assembly by standard surface
mount equipment.
Digital TV, WLAN, GPS and Bluetooth™
Applications
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POL Applications
250
225
200
100
90
VI = 3.6 V,
VO = 1.8 V
80
Efficiency
PFM/PWM Operation
175
150
70
60
TPS82671SIP
DC/DC Converter
L
V
V
125
100
50
40
30
20
10
0
IN
2.3 V .. 4.8 V
OUT
1.8 V @ 600mA
SW
VIN
CO
CI
FB
GND
EN
75
50
25
Power Loss
PFM/PWM Operation
MODE
SELECTION
ENABLE
MODE
GND
0
0.1
1
10
100
1000
Figure 1. Typical Application
I
- Load Current - mA
O
Figure 2. Efficiency vs. Load Current
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
MicroSiP is a trademark of Texas Instruments.
Bluetooth is a trademark of Bluetooth SIG, Inc.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2012, Texas Instruments Incorporated