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TPS826721 PDF预览

TPS826721

更新时间: 2024-11-05 11:13:51
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德州仪器 - TI 转换器
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31页 5800K
描述
采用 MicroSiP™ 封装的 600mA 完全集成式低噪声降压转换器模块

TPS826721 数据手册

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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676  
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195  
SLVSAI0J OCTOBER 2010REVISED MAY 2016  
TPS8267x 600-mA, High-Efficiency MicroSiP™ Step-Down Converter (Profile <1.0mm)  
1 Features  
3 Description  
The TPS8267x device is a complete 600mA, DC/DC  
step-down power supply intended for low-power  
applications. Included in the package are the  
switching regulator, inductor and input/output  
capacitors. No additional components are required to  
finish the design.  
1
90% Efficiency at 5.5 MHz Operation  
17μA Quiescent Current  
Wide VIN Range From 2.3 V to 4.8 V  
5.5MHz Regulated Frequency Operation  
Spread Spectrum, PWM Frequency Dithering  
Best in Class Load and Line Transient  
±2% Total DC Voltage Accuracy  
The TPS8267x is based on  
synchronous step-down dc-dc converter optimized for  
battery-powered portable applications. The  
MicroSiP™ DC/DC converter operates at a regulated  
5.5-MHz switching frequency and enters the power-  
save mode operation at light load currents to maintain  
high efficiency over the entire load current range.  
a high-frequency  
Automatic PFM/PWM Mode Switching  
Low Ripple Light-Load PFM Mode  
35dB VIN PSRR (1kHz to 10kHz)  
Internal Soft Start, 120-µs Start-Up Time  
The PFM mode extends the battery life by reducing  
the quiescent current to 17μA (typ) during light load  
operation. For noise-sensitive applications, the device  
has PWM spread spectrum capability providing a  
lower noise regulated output, as well as low noise at  
the input. These features, combined with high PSRR  
and AC load regulation performance, make this  
device suitable to replace a linear regulator to obtain  
better power conversion efficiency.  
Integrated Active Power-Down Sequencing  
(Optional)  
Current Overload and Thermal Shutdown  
Protection  
Sub 1-mm Profile Solution  
Total Solution Size <6.7 mm2  
2 Applications  
The TPS8267x is packaged in a compact (2.3mm x  
2.9mm) and low profile (1.0mm) BGA package  
suitable for automated assembly by standard surface  
mount equipment.  
Cell Phones, Smart-Phones  
Camera Module, Optical Data Module  
Wearable Electronics  
Digital TV, WLAN, GPS and Bluetooth™  
Applications  
Device Information(1)  
PART NUMBER  
PACKAGE  
BODY SIZE (NOM)  
POL Applications  
TPS8267x  
µSIP (8)  
2.30 x 2.90 mm  
(1) For all available packages, see the orderable addendum at  
the end of the datasheet.  
4 Simplified Schematic  
spacer  
spacer  
Efficiency vs Output Current  
250  
225  
200  
100  
90  
VI = 3.6 V,  
VO = 1.8 V  
TPS82671SIP  
80  
Efficiency  
PFM/PWM Operation  
DC/DC Converter  
175  
150  
L
70  
60  
V
V
IN  
2.3 V .. 4.8 V  
OUT  
1.8 V @ 600mA  
SW  
VIN  
CO  
CI  
125  
100  
50  
40  
30  
20  
10  
0
FB  
GND  
EN  
MODE  
SELECTION  
ENABLE  
MODE  
75  
50  
25  
Power Loss  
PFM/PWM Operation  
GND  
Copyright © 2016, Texas Instruments Incorporated  
0
0.1  
1
10  
100  
1000  
I
- Load Current - mA  
O
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION  
DATA.  
 
 
 
 
 
 
 
 

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