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TPS820B

更新时间: 2024-11-10 03:58:39
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 161K
描述
Silicon Epitaxial Planar

TPS820B 数据手册

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TPS820(B,F)  
TOSHIBA Photo-IC Silicon Epitaxial Planar  
TPS820(B,F)  
Lead(Pb)-Free  
Unit: mm  
Photo-Electric Switches  
Copiers, Printers, and Facsimiles  
Luminosity Adjustment for Various  
Types of Equipment  
The TPS820(B,F) is a linear output photo-IC  
(current output type) which incorporates a  
photodiode and a current amp circuit in a single  
chip.  
The sensitivity is superior to that of a  
phototransistor and its illuminance output linearity  
is excellent.  
High sensitivity: I = 1.5 mA (Min) @E = 0.1  
L
mW/cm2  
Little fluctuation in light current  
Output linearity of illuminance is excellent.  
Low current consumption: I  
= 1 μA (max) at  
CC  
TOSHIBA  
0-3H1  
V
CC  
= 5 V  
Weight: 0.12 g (typ.)  
Housed in compact side-view epoxy resin  
package  
Black package impermeable to visible light  
The TPS820 is suitable for use in combination  
with the TLN117(F) infrared LED lamp whose package size is the same.  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Supply voltage  
Symbol  
Rating  
Unit  
V
0.5~7  
V
V
CC  
<
Output voltage  
V
V
=
O
CC  
Light current  
I
10  
mA  
mW  
mW/°C  
°C  
L
Power dissipation  
P
250  
3.33  
Power dissipation derating  
Operating temperature range  
Storage temperature range  
Soldering temperature (5 s) (Note1)  
ΔP/°C  
T
opr  
25~85  
40~100  
260  
T
°C  
stg  
sol  
T
°C  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings and the operating ranges.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: At the location of 1.3 mm from the resin package bottom  
1
2007-10-01  

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