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TPS61255YFF

更新时间： 2024-02-15 10:12:56
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德州仪器 - TI 转换器功效
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34页 6073K
描述
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING

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TPS61255YFF 数据手册

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TPS61253, TPS61254, TPS61256, TPS61258  
www.ti.com  
SLVSAG8B –SEPTEMBER 2011–REVISED MAY 2012  
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING  
Check for Samples: TPS61253, TPS61254, TPS61256, TPS61258  
1
FEATURES  
DESCRIPTION  
•
•
•
•
•
•
•
•
•
•
•
93% Efficiency at 3.5MHz Operation  
22µA Quiescent Current in Standby Mode  
36µA Quiescent Current in Normal Operation  
Wide VIN Range From 2.3V to 5.5V  
The TPS6125x device provides a power supply  
solution for battery-powered portable applications.  
Intended for low-power applications, the TPS6125x  
supports up to 800-mA load current from a battery  
discharged as low as 2.65V and allows the use of low  
cost chip inductor and capacitors.  
VIN ≥ VOUT Operation  
IOUT ≥800mA at VOUT = 4.5V, VIN ≥2.65V  
IOUT ≥1000mA at VOUT = 5.0V, VIN ≥3.3V  
IOUT ≥1500mA (Peak) at VOUT = 5.0V, VIN ≥3.3V  
With a wide input voltage range of 2.3V to 5.5V, the  
device supports applications powered by Li-Ion  
batteries with extended voltage range. Different fixed  
voltage output versions are available from 3.15V to  
5.0V.  
±2% Total DC Voltage Accuracy  
Light-Load PFM Mode  
The TPS6125x operates at a regulated 3.5-MHz  
switching frequency and enters power-save mode  
operation at light load currents to maintain high  
efficiency over the entire load current range. The  
PFM mode extends the battery life by reducing the  
quiescent current to 36μA (typ) during light load  
operation.  
Selectable Standby Mode or True Load  
Disconnect During Shutdown  
•
•
Thermal Shutdown and Overload Protection  
Only Three Surface-Mount External  
Components Required  
Total Solution Size <25mm2  
9-Pin NanoFreeTM (CSP) Packaging  
•
•
In addition, the TPS6125x device can also maintain  
its output biased at the input voltage level. In this  
mode, the synchronous rectifier is current limited  
allowing external load (e.g. audio amplifier) to be  
powered with a restricted supply. In this mode, the  
quiescent current is reduced to 22µA. Input current in  
shutdown mode is less than 1µA (typ), which  
maximizes battery life.  
APPLICATIONS  
•
•
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Cell Phones, Smart-Phones  
Mono and Stereo APA Applications  
USB Charging Port (5V)  
The TPS6125x offers a very small solution size due  
to minimum amount of external components. It allows  
the use of small inductors and input capacitors to  
achieve a small solution size. During shutdown, the  
load is completely disconnected from the battery.  
spacer  
spacer  
VO = 5.0 V  
100  
90  
80  
70  
60  
50  
40  
30  
20  
VOUT  
5.0 V @ 700mA  
TPS61256  
L
SW  
VIN  
EN  
VOUT  
BP  
VIN  
2.65 V .. 4.85 V  
1 μH  
CO  
10 uF  
CI  
4.7 μF  
.
GND  
10  
0
Figure 2. Smallest Solution Size Application  
Figure 1. Efficiency vs. Load Current  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011–2012, Texas Instruments Incorporated  
 
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与TPS61255YFF相关器件

型号 品牌 获取价格 描述 数据表
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 		3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING
TPS612561A TI

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 		采用 1.2mm x 1.3mm WCSP 封装且具有直通模式的 3.5MHz、5V、90
TPS612562CYFFT TI

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 		采用 1.2mm x 1.3mm WCSP 封装且具有直通模式的 3.5MHz、5V、90
TPS612564CYFFR TI

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 		采用 1.2mm x 1.3mm WCSP 封装且具有直通模式的 3.5MHz、5V、90
TPS612564CYFFT TI

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 		采用 1.2mm x 1.3mm WCSP 封装且具有直通模式的 3.5MHz、5V、90
TPS61256A TI

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 		采用 1.2mm x 1.3mm WCSP 封装的 3.5MHz、5V、1A 负载升压转换
TPS61256AYFFR TI

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 		采用 1.2mm x 1.3mm WCSP 封装的 3.5MHz、5V、1A 负载升压转换
TPS61256AYFFT TI

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 		采用 1.2mm x 1.3mm WCSP 封装的 3.5MHz、5V、1A 负载升压转换
TPS61256C TI

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 		采用 1.2mm x 1.3mm WCSP 封装且具有直通模式的 3.5MHz、5V、90

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