是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | DSBGA-9 | 针数: | 9 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 0.73 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 280124 |
Samacsys Pin Count: | 9 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | BGA | Samacsys Footprint Name: | YFF0009-1 |
Samacsys Released Date: | 2020-01-02 13:08:37 | Is Samacsys: | N |
其他特性: | ALSO HAS PFM CONTROL TECHNIQUE | 模拟集成电路 - 其他类型: | SWITCHING REGULATOR |
控制模式: | CURRENT-MODE | 控制技术: | PULSE WIDTH MODULATION |
最大输入电压: | 4.85 V | 最小输入电压: | 2.65 V |
标称输入电压: | 3.6 V | JESD-30 代码: | S-PBGA-B9 |
JESD-609代码: | e1 | 长度: | 1.6 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 9 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电流: | 4.6 A |
最大输出电压: | 5.2 V | 最小输出电压: | 4.75 V |
标称输出电压: | 5 V | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA9,3X3,16 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.625 mm | 子类别: | Switching Regulator or Controllers |
表面贴装: | YES | 切换器配置: | BOOST |
最大切换频率: | 3500 kHz | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 1.6 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TPS61253YFFR | TI |
类似代替 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61256YFFR | TI |
类似代替 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61256YFFT | TI |
类似代替 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TPS61254 | TI |
获取价格 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61254A | TI |
获取价格 |
TPS61253A 3.8-MHz, 5-V / 4-A Boost Converter in 1.2-mm x 1.3-mm WCSP | |
TPS61254YFF | TI |
获取价格 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61254YFFR | TI |
获取价格 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61254YFFT | TI |
获取价格 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61255 | TI |
获取价格 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61255A | TI |
获取价格 |
TPS61253A 3.8-MHz, 5-V / 4-A Boost Converter in 1.2-mm x 1.3-mm WCSP | |
TPS61255YFF | TI |
获取价格 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS61256 | TI |
获取价格 |
3.5-MHz HIGH EFFICIENCY STEP-UP CONVERTER IN CHIP SCALE PACKAGING | |
TPS612561A | TI |
获取价格 |
TPS61253A 3.8-MHz, 5-V / 4-A Boost Converter in 1.2-mm x 1.3-mm WCSP |