TPS54611-EP, TPS54612-EP
TPS54613-EP, TPS54614-EP
Typical Size
6,6 mm X 9,8 mm
TPS54615-EP, TPS54616-EP
www.ti.com
SGLS293A–FEBRUARY 2005–REVISED AUGUST 2005
3-V TO 6-V INPUT, 6-A OUTPUT SYNCHRONOUS BUCK PWM
SWITCHER WITH INTEGRATED FETs (SWIFT™)
FEATURES
APPLICATIONS
•
Low-Voltage, High-Density Systems With
Power Distributed at 5 V or 3.3 V
•
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
•
Point of Load Regulation for High
Performance DSPs, FPGAs, ASICs and
Microprocessors
•
•
Extended Temperature Performance of –55°C
to 125°C
•
•
Broadband, Networking and Optical
Communications Infrastructure
Portable Computing/Notebook PCs
Enhanced Diminishing Manufacturing
Sources (DMS) Support
•
•
•
Enhanced Product-Change Notification
(1)
DESCRIPTION
Qualification Pedigree
30-mΩ, 12-A Peak MOSFET Switches for High
Efficiency at 6-A Continuous Output Source
and Sink
The SWIFT™ family of dc/dc regulators, the
TPS54611, TPS54612, TPS54613, TPS54614,
TPS54615, and TPS54616 low-input voltage
high-output
current
synchronous-buck
PWM
•
•
0.9-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V
Fixed Output Voltage Devices With 1% Initial
Accuracy
converters integrate all required active components.
Included on the substrate are true, high-performance,
voltage error amplifiers that provide high performance
under transient conditions; an under-voltage lockout
circuit to prevent start-up until the input voltage
Internally Compensated for Easy Use and
Minimal Component Count
reaches
3 V; an internally and externally set
•
•
Fast Transient Response
slow-start circuit to limit in-rush currents; and a power
good output useful for processor/logic reset, fault
signaling, and supply sequencing.
Wide PWM Frequency - Fixed 350 kHz,
550 kHz or Adjustable 280 kHz to 700 kHz
•
•
Load Protected by Peak Current Limit and
Thermal Shutdown
The TPS54611-6 devices are available in a thermally
enhanced 28-pin TSSOP (PWP) PowerPAD™
package, which eliminates bulky heatsinks. Texas
Instruments provides evaluation modules and the
SWIFT™ designer software tool to aid in quickly
achieving high-performance power supply designs to
meet aggressive equipment development cycles.
Integrated Solution Reduces Board Area and
Total Cost
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SWIFT, PowerPAD are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.