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TPS53679RSBR PDF预览

TPS53679RSBR

更新时间: 2024-11-27 11:13:23
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德州仪器 - TI 控制器
页数 文件大小 规格书
10页 407K
描述
具有 NVM 和 PMBus 的双通道 6+1/5+2 VR13 D-CAP+™ 降压多相控制器 | RSB | 40 | -40 to 125

TPS53679RSBR 数据手册

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TPS53679  
SLUSD40 JULY 2017  
TPS53679 Dual-Channel (6-Phase +1-Phase) or (5-Phase + 2-Phase) D-CAP+™ Step-Down  
Multiphase Controller  
with NVM and PMBus™ for VR13 Server V  
CORE  
1 Device Overview  
1.1 Features  
1
• Intel VR13 Serial VID (SVID) Compliant  
• Full VR13 Server Feature Set Including Digital  
Input Power Monitor  
• Driverless Configuration for Efficient High-  
Frequency Switching  
• Fully Compatible with TI NextFET™ Power Stage  
for High-Density Solutions  
• Programmable Loop Compensations  
• Accurate, Adjustable Voltage Positioning  
• Patented AutoBalance™ Phase Balancing  
• Selectable, 16-level Per-Phase Current Limit  
• Configurable with Non-Volatile Memory (NVM) for  
Low External Component Counts  
• Individual Phase Current Calibrations and Reports  
• Dynamic Phase Shedding with Programmable  
Current Threshold for Optimizing Efficiency at Light  
and Heavy Loads  
• PMBus™ System Interface for Telemetry of  
Voltage, Current, Power, Temperature, and Fault  
Conditions  
• Fast Phase-Adding for Undershoot Reduction  
(USR)  
• Backward VR12.0 and VR12.5 Compatible  
• Dynamic Output Voltage Transitions with  
Programmable Slew Rates via SVID or PMBus  
Interface  
• Conversion Voltage Range: 4.5 V to 17 V  
• Low Quiescent Current  
• 8-Bit DAC with Selectable 5 mV or 10 mV  
Resolution and Output Ranges from 0.25 V to  
1.52 V or 0.5 to 2.8125 V for Dual Channels  
1.2 Applications  
ASIC Needs Dual Power Rails  
High-Performance Processor Power  
1.3 Description  
The TPS53679 is a fully VR13 SVID compliant step-down controller with dual channels, built-in non-  
volatile memory (NVM), and PMBus™ interface, and is fully compatible with TI NexFET ™power stage.  
Advanced control features such as D-CAP+™ architecture with undershoot reduction (USR) provide fast  
transient response, low output capacitance, and good current sharing. The device also provides novel  
phase interleaving strategy and dynamic phase shedding for efficiency improvement at different loads.  
Adjustable control of VCORE slew rate and voltage positioning round out the Intel® VR13™ features. In  
addition, the device supports the PMBus communication interface for reporting the telemetry of voltage,  
current, power, temperature, and fault conditions to the systems. All programmable parameters can be  
configured by the PMBus interface and can be stored in NVM as the new default values to minimize the  
external component count.  
The TPS53679 device if offered in a thermally enhanced -pin QFN packaged and is rated to operate from  
–40°C to 125°C.  
Table 1-1. Device Information(1)  
PART NUMBER  
PACKAGE  
BODY SIZE  
TPS53679  
QFN (40)  
5 mm × 5 mm  
(1) For more information, see, Mechanical, Packaging, and Orderable Information.  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 

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