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TPHR9003NL PDF预览

TPHR9003NL

更新时间: 2024-11-05 21:16:15
品牌 Logo 应用领域
东芝 - TOSHIBA 开关脉冲光电二极管晶体管
页数 文件大小 规格书
9页 227K
描述
Nch VDSS≤30V

TPHR9003NL 技术参数

生命周期:Active包装说明:SMALL OUTLINE, S-PDSO-F5
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:2.05雪崩能效等级(Eas):889 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):60 A
最大漏源导通电阻:0.0014 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-F5元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):200 A表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

TPHR9003NL 数据手册

 浏览型号TPHR9003NL的Datasheet PDF文件第2页浏览型号TPHR9003NL的Datasheet PDF文件第3页浏览型号TPHR9003NL的Datasheet PDF文件第4页浏览型号TPHR9003NL的Datasheet PDF文件第5页浏览型号TPHR9003NL的Datasheet PDF文件第6页浏览型号TPHR9003NL的Datasheet PDF文件第7页 
TPHR9003NL  
MOSFETs Silicon N-channel MOS (U-MOS-H)  
TPHR9003NL  
1. Applications  
Switching Voltage Regulators  
DC-DC Converters  
2. Features  
(1) High-speed switching  
(2) Small gate charge: QSW = 16 nC (typ.)  
(3) Low drain-source on-resistance: RDS(ON) = 1.1 m(typ.) (VGS = 4.5 V)  
(4) Low leakage current: IDSS = 10 µA (max) (VDS = 30 V)  
(5) Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 1.0 mA)  
3. Packaging and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
SOP Advance  
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
Power dissipation  
VDSS  
VGSS  
ID  
30  
±20  
220  
60  
(Silicon limit)  
(Tc = 25 )  
(t = 1 ms)  
(Note 1), (Note 2)  
(Note 1)  
A
ID  
(Note 1)  
IDP  
PD  
200  
78  
(Tc = 25 )  
(t = 10 s)  
W
(Note 3)  
(Note 4)  
(Note 5)  
PD  
2.8  
(t = 10 s)  
PD  
1.6  
Single-pulse avalanche energy  
Avalanche current  
EAS  
IAR  
Tch  
Tstg  
889  
60  
mJ  
A
Channel temperature  
Storage temperature  
150  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2013-03-01  
Rev.1.0  
1

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