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TPCP8F01 PDF预览

TPCP8F01

更新时间: 2024-11-20 03:26:47
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体晶体管场效应晶体管
页数 文件大小 规格书
8页 249K
描述
TOSHIBA Multi-chip Device Silicon PNP Epitaxial Transistor , Field Effect Transistor Silicon N Channel MOS Type

TPCP8F01 数据手册

 浏览型号TPCP8F01的Datasheet PDF文件第2页浏览型号TPCP8F01的Datasheet PDF文件第3页浏览型号TPCP8F01的Datasheet PDF文件第4页浏览型号TPCP8F01的Datasheet PDF文件第5页浏览型号TPCP8F01的Datasheet PDF文件第6页浏览型号TPCP8F01的Datasheet PDF文件第7页 
TPCP8F01  
TOSHIBA Multi-chip Device  
Silicon PNP Epitaxial Transistor , Field Effect Transistor Silicon N Channel MOS Type  
TPCP8F01  
Unit: mm  
Swtching Applications  
0.33±0.05  
A
M
0.05  
Load Switch Applications  
5
8
Multi-chip discrete device; built-in PNP Transistor for  
main switch and N-ch MOS FET for drive  
0.475  
1
4
B
B
M
0.05  
High DC current gain: h  
= 200 to 500 (I = 0.5 A)  
0.65  
FE C  
2.9±0.1  
A
(PNP Transistor)  
= 0.19 V (max)  
0.8±0.05  
Low collector-emitter saturation: V  
CE (sat)  
S
0.025  
(PNP Transistor)  
High-speed switching: t = 40 ns (typ.) (PNP Transistor)  
+0.1  
0.28  
S
0.17±0.02  
-0.11  
f
+0.13  
1.12  
1.12  
-0.12  
+0.13  
-0.12  
Absolute Maximum Ratings (Ta = 25°C)  
Transistor  
+0.1  
0.28  
1.Source  
5.Emitter  
6.Base  
7.Gate  
-0.11  
2.Collector  
3.Collector  
4.Collector  
Characteristics  
Symbol  
Rating  
Unit  
V
8.Drain  
JEDEC  
Collector-base voltage  
V
30  
CBO  
JEITA  
Collector-emitter voltage  
Emitter-base voltage  
V
V
20  
7  
V
V
TOSHIBA  
2-3V1B  
CEO  
Weight : 0.017g (Typ.)  
EBO  
DC  
I
3.0  
5.0  
250  
1.0  
C
Collector current  
A
Pulse  
I
CP  
Base current  
I
mA  
W
B
Collector power dissipation  
Junction temperature  
P (Note 1)  
C
T
150  
°C  
j
MOS FET  
Characteristics  
Symbol  
Rating  
Unit  
Drain-source voltage  
Gate-source voltage  
V
V
20  
V
V
DSS  
±10  
100  
200  
150  
GSS  
DC  
I
D
Drain current  
mA  
°C  
Pulse  
I
DP  
Channel temperature  
T
j
Note 1: Mounted on FR4 board (glass epoxy, 1.6mm thick, Cu area: 645mm2)  
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2006-11-13  

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