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TPCP8111 PDF预览

TPCP8111

更新时间: 2024-02-07 07:07:18
品牌 Logo 应用领域
东芝 - TOSHIBA 开关光电二极管晶体管
页数 文件大小 规格书
9页 227K
描述
Pch Power MOSFET

TPCP8111 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F8Reach Compliance Code:unknown
风险等级:5.76配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (ID):3 A
最大漏源导通电阻:0.1584 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F8元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL参考标准:AEC-Q101
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

TPCP8111 数据手册

 浏览型号TPCP8111的Datasheet PDF文件第2页浏览型号TPCP8111的Datasheet PDF文件第3页浏览型号TPCP8111的Datasheet PDF文件第4页浏览型号TPCP8111的Datasheet PDF文件第5页浏览型号TPCP8111的Datasheet PDF文件第6页浏览型号TPCP8111的Datasheet PDF文件第7页 
TPCP8111  
MOSFETs Silicon P-Channel MOS (U-MOS)  
TPCP8111  
1. Applications  
Motor Drivers  
Mobile Equipment  
2. Features  
(1) Small, thin package  
(2) Small gate charge: QSW = 5.2 nC (typ.)  
(3) Low drain-source on-resistance: RDS(ON) = 90 m(typ.) (VGS = -10 V)  
(4) Low leakage current: IDSS = -10 µA (max) (VDS = -60 V)  
(5) Enhancement mode: Vth = -2 to -3 V (VDS = -10 V, ID = -1 mA)  
3. Packaging and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
PS-8  
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
VDSS  
VGSS  
ID  
-60  
-20/+10  
-3  
(Note 1)  
(Note 1)  
(Note 2)  
(Note 3)  
(Note 4)  
A
IDP  
-12  
(t = 5 s)  
(t = 5 s)  
PD  
1.96  
W
Power dissipation  
PD  
0.94  
Single-pulse avalanche energy  
Avalanche current  
EAS  
IAR  
31.1  
mJ  
A
-3  
Channel temperature  
Storage temperature  
(Note 5)  
Tch  
Tstg  
175  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2013-10-22  
Rev.1.0  
1

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