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TPCP8105(TE85L,F) PDF预览

TPCP8105(TE85L,F)

更新时间: 2024-02-20 22:13:07
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
9页 230K
描述
TRANSISTOR,MOSFET,P-CHANNEL,20V V(BR)DSS,7.2A I(D),FP

TPCP8105(TE85L,F) 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
风险等级:5.61配置:Single
最大漏极电流 (Abs) (ID):7.2 AFET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):1.68 W
子类别:Other Transistors表面贴装:YES
Base Number Matches:1

TPCP8105(TE85L,F) 数据手册

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TPCP8105  
MOSFETs Silicon P-Channel MOS (U-MOS)  
TPCP8105  
1. Applications  
Lithium-Ion Secondary Batteries  
Power Management Switches  
Notebook PCs  
2. Features  
(1) Small, thin package  
(2) Low drain-source on-resistance: RDS(ON) = 13.8 m(typ.) (VGS = -4.5 V)  
(3) Low leakage current: IDSS = -10 µA (max) (VDS = -20 V)  
(4) Enhancement mode: Vth = -0.5 to -1.2 V (VDS = -10 V, ID = -1 mA)  
3. Packaging and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
PS-8  
4. Absolute Maximum Ratings (Note) (Ta = 25unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
VDSS  
VGSS  
-20  
±12  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
(Note 1)  
(Note 1)  
(Note 2)  
(Note 3)  
(Note 4)  
ID  
IDP  
PD  
PD  
EAS  
IAR  
-7.2  
-28.8  
1.68  
0.84  
33.0  
-7.2  
A
(t = 5 s)  
(t = 5 s)  
W
W
mJ  
A
Single-pulse avalanche energy  
Avalanche current  
Channel temperature  
Storage temperature  
Tch  
150  
Tstg  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2012-09-26  
Rev.2.0  
1

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