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TPCF8B01 PDF预览

TPCF8B01

更新时间: 2024-11-26 03:26:47
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体二极管小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
4页 78K
描述
TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode

TPCF8B01 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Lifetime Buy包装说明:SMALL OUTLINE, R-PDSO-F8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.27
Is Samacsys:N配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):2.7 A
最大漏极电流 (ID):2.7 A最大漏源导通电阻:0.16 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-F8
元件数量:1端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):1.35 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

TPCF8B01 数据手册

 浏览型号TPCF8B01的Datasheet PDF文件第2页浏览型号TPCF8B01的Datasheet PDF文件第3页浏览型号TPCF8B01的Datasheet PDF文件第4页 
TPCF8B01  
TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode  
TPCF8B01  
Notebook PC Applications  
Portable Equipment Applications  
Unit: mm  
·
·
·
·
·
Low drain-source ON resistance: R = 72 mÙ (typ.)  
DS (ON)  
High forward transfer admittance: |Y | = 4.7 S (typ.)  
fs  
Low leakage current: I  
= - 10 ìA (max) (V  
= - 20 V)  
DSS  
DS  
Enhancement-model: V = - 0.5 to - 1.2 V(V  
=- 10 V, I = - 200 ìA)  
th  
DS  
D
Low forward voltage: V  
= 0.46V(typ.)  
FM  
Maximum Ratings  
MOSFET (Ta 25°C)  
=
Characteristics  
Symbol  
Rating  
Unit  
Drain-source voltage  
V
- 20  
- 20  
V
V
V
DSS  
Drain-gate voltage (R  
Gate-source voltage  
= 20 kW)  
V
GS  
DGR  
V
±8  
GSS  
1. Anode 5. Drain  
2. Anode 6. Drain  
3.Source 7. Cathode  
DC  
(Note 1)  
(Note 1)  
(Note 4)  
I
- 2.7  
- 10.8  
1.2  
D
Drain current  
A
Pulse  
I
DP  
4. Gate  
8. Cathode  
Single pulse avalanche energy  
Avalanche current  
E
mJ  
A
AS  
AR  
JEDEC  
JEITA  
I
- 1.35  
Repetitive avalanche energy  
Single-device value at dual operation  
E
0.11  
mJ  
AR  
(Note 2a, 3b, 5)  
TOSHIBA  
Weight: 0.011 g (typ.)  
SBD (Ta  
= 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
Circuit Configuration  
8
7
5
6
Repetitive peak reverse voltage  
V
20  
V
A
RRM  
Average forward current (Note 2a, 6)  
I
1.0  
F(AV)  
Peak one cycle surge forward current  
(non-repetitive)  
I
7(50Hz)  
A
FSM  
Maximum Ratings for MOSFET and SBD (Ta  
= 25°C)  
Characteristics  
Symbol  
Rating  
1.35  
1.12  
0.53  
0.33  
Unit  
1
2
4
3
Single-device operation  
(Note 3a)  
P
P
P
P
D (1)  
D (2)  
D (1)  
D (2)  
Drain power  
dissipation  
Marking (Note 7)  
(t = 5 s) (Note 2a) Single-device value at  
8
5
dual operation (Note 3b)  
W
Single-device operation  
Drain power  
dissipation  
(Note 3a)  
F8A  
Single-device value at  
dual operation (Note 3b)  
(t = 5 s) (Note 2b)  
Channel temperature  
T
150  
°C  
°C  
ch  
1
4
Storage temperature range  
T
- 55~150  
stg  
Note: For (Note 1), (Note 2), (Note 3), (Note 4), (Note 5), (Note 6) and (Note 7), please refer to the next page.  
1
2003-04-08  

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