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TPCC8131 PDF预览

TPCC8131

更新时间: 2024-11-25 12:35:51
品牌 Logo 应用领域
东芝 - TOSHIBA 电池开关
页数 文件大小 规格书
9页 240K
描述
Lithium-Ion Secondary Batteries Power Management Switches

TPCC8131 技术参数

生命周期:Active包装说明:SMALL OUTLINE, S-PDSO-F5
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.71
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):10 A
最大漏极电流 (ID):10 A最大漏源导通电阻:0.023 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-F5
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):20 W子类别:Other Transistors
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TPCC8131 数据手册

 浏览型号TPCC8131的Datasheet PDF文件第2页浏览型号TPCC8131的Datasheet PDF文件第3页浏览型号TPCC8131的Datasheet PDF文件第4页浏览型号TPCC8131的Datasheet PDF文件第5页浏览型号TPCC8131的Datasheet PDF文件第6页浏览型号TPCC8131的Datasheet PDF文件第7页 
TPCC8131  
MOSFETs Silicon P-Channel MOS (U-MOS)  
TPCC8131  
1. Applications  
Lithium-Ion Secondary Batteries  
Power Management Switches  
2. Features  
(1) Small, thin package  
(2) Low drain-source on-resistance: RDS(ON) = 13.5 m(typ.) (VGS = -10 V)  
(3) Low leakage current: IDSS = -10 µA (max) (VDS = -30 V)  
(4) Enhancement mode: Vth = -0.8 to -2.0 V (VDS = -10 V, ID = -0.2 mA)  
3. Packaging and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
TSON Advance  
4. Absolute Maximum Ratings (Note) (Ta = 25unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
Power dissipation  
VDSS  
VGSS  
ID  
-30  
-25/+20  
-10  
(Note 1)  
(Note 1)  
A
IDP  
-30  
(Tc = 25)  
(t = 10 s)  
(t = 10 s)  
PD  
20  
W
W
W
mJ  
A
(Note 2)  
(Note 3)  
(Note 4)  
PD  
1.9  
PD  
0.7  
Single-pulse avalanche energy  
Avalanche current  
EAS  
IAR  
65  
-10  
Channel temperature  
Storage temperature  
Tch  
Tstg  
150  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2011-06-09  
Rev.2.0  
1

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