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TPCC8105 PDF预览

TPCC8105

更新时间: 2024-11-25 12:35:51
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体电池开关小信号场效应晶体管光电二极管
页数 文件大小 规格书
7页 225K
描述
Lithium Ion Battery Applications Power Management Switch Applications

TPCC8105 技术参数

生命周期:Active包装说明:SMALL OUTLINE, S-PDSO-F8
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.69
Is Samacsys:N外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (ID):23 A最大漏源导通电阻:0.0104 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-F8
元件数量:1端子数量:8
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
极性/信道类型:P-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TPCC8105 数据手册

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TPCC8105  
TOSHIBA Field Effect Transistor Silicon P-Channel MOS Type (U-MOS)  
TPCC8105  
Lithium Ion Battery Applications  
Unit: mm  
Power Management Switch Applications  
Small footprint due to a small and thin package  
Low drain-source ON-resistance:  
R
= 6.0 mΩ (typ.)( V  
= 10 V)  
DS (ON)  
GS  
Low leakage current: I  
= 10 μA (max) (V  
= 30 V)  
DSS  
DS  
Enhancement mode: V = 0.8 to 2.0 V (V  
= 10 V, I = 0.5 mA)  
D
th  
DS  
Absolute Maximum Ratings (T = 25°C)  
a
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
30  
30  
V
V
V
DSS  
V
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
DGR  
GS  
V
25/+20  
23  
GSS  
DC  
(Note 1)  
I
D
Drain current  
A
Pulsed (Note 1)  
I
69  
DP  
Drain power dissipation  
Drain power dissipation  
(T = 25°C)  
P
30  
W
W
c
D
D
(t = 10 s)  
(Note 2a)  
(t = 10 s)  
(Note 2b)  
P
1.9  
0.7  
138  
Drain power dissipation  
P
W
D
Single-pulse avalanche energy  
(Note 3)  
1,2,3 :SOURCE 4:GATE  
5,6,7,8:DRAIN  
E
mJ  
AS  
Avalanche current  
I
23  
150  
A
AR  
JEDEC  
T
°C  
°C  
Channel temperature  
Storage temperature range  
ch  
JEITA  
T
55 to 150  
stg  
TOSHIBA  
2-3X1A  
Note: For Notes 1 to 4, refer to the next page.  
Weight: 0.02 g (typ.)  
Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings. Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability  
Handbook (“Handling Precautions”/“Derating Concept and  
Methods”) and individual reliability data (i.e. reliability test report  
and estimated failure rate, etc).  
Circuit Configuration  
8
7
6
5
This transistor is an electrostatic-sensitive device. Handle with care.  
1
2
3
4
1
2010-09-03  

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