TPA4411
TPA4411M
www.ti.com
SLOS430E–AUGUST 2004–REVISED MARCH 2008
80-mW DIRECTPATH™ STEREO HEADPHONE DRIVER
1
FEATURES
2
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Space Saving Packages
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20-Pin, 4 mm × 4 mm Thin QFN
1
2
3
4
5
1
2
3
4
5
15
14
15
14
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TPA4411 – Thermally Optimized
PowerPAD™ Package
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12
13
12
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TPA4411M – Thermally Enhanced
PowerPAD™ Package
11
11
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16-Ball, 2.18 mm × 2.18 mm WCSP
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Ground-Referenced Outputs Eliminate
TPA4411RTJ
TPA4411MRTJ
DC-Bias Voltages on Headphone Ground Pin
A2
A3
A4
–
No Output DC-Blocking Capacitors
INR
SGND PVDD C1P
A1
B1
–
–
–
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Reduced Board Area
SDR
SDL
NC PGND
Reduced Component Cost
Improved THD+N Performance
INL
OUTR
NC
C1N
C1
D1
No Degradation of Low-Frequency
Response Due to Output Capacitors
SVDD OUTL SVSS PVSS
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•
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Wide Power Supply Range: 1.8 V to 4.5 V
80-mW/Ch Output Power into 16-Ω at 4.5 V
TPA4411YZH
Independent Right and Left Channel
Shutdown Control
DESCRIPTION
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•
Short-Circuit and Thermal Protection
Pop Reduction Circuitry
The TPA4411 and TPA4411M are stereo headphone
drivers designed to allow the removal of the output
DC-blocking capacitors for reduced component count
and cost. The TPA4411 and TPA4411M are ideal for
small portable electronics where size and cost are
critical design parameters.
APPLICATIONS
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•
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Notebook Computers
CD / MP3 Players
Smart Phones
Cellular Phones
PDAs
The TPA4411 and TPA4411M are capable of driving
80 mW into a 16-Ω load at 4.5 V. Both TPA4411 and
TPA4411M have a fixed gain of –1.5 V/V and
headphone outputs that have ±8-kV IEC ESD
protection. The TPA4411 and TPA4411M have
independent shutdown control for the right and left
audio channels.
The TPA4411 is available in a 2.18 mm × 2.18 mm
WCSP and 4 mm × 4 mm Thin QFN packages. The
TPA4411M is available in a 4 mm × 4 mm Thin QFN
package. The TPA4411RTJ package is a thermally
optimized PowerPAD™ package allowing the
maximum amount of thermal dissipation and the
TPA4411MRTJ is a thermally enhanced PowerPAD
package designed to match competitive package
footprints.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
PowerPAD, DirectPath are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated