TP3071N-G

更新时间： 2024-09-16 03:07:19

品牌	Logo	应用领域
美国国家半导体 - NSC		/
页数	文件大小	规格书
3页	84K
描述
Engineering Project Manager

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技术参数
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TP3071N-G 技术参数

是否Rohs认证：	不符合	生命周期：	Transferred
包装说明：	PLASTIC, DIP-20	Reach Compliance Code：	not_compliant
HTS代码：	8542.39.00.01	风险等级：	7.72
压伸定律：	A/MU-LAW	滤波器：	YES
最大增益公差：	0.15 dB	JESD-30 代码：	R-PDIP-T20
JESD-609代码：	e0	长度：	26.075 mm
线性编码：	NOT AVAILABLE	湿度敏感等级：	1
负电源额定电压：	-5 V	功能数量：	1
端子数量：	20	工作模式：	SYNCHRONOUS
最高工作温度：	70 °C	最低工作温度：
封装主体材料：	PLASTIC/EPOXY	封装代码：	DIP
封装等效代码：	DIP20,.3	封装形状：	RECTANGULAR
封装形式：	IN-LINE	峰值回流温度（摄氏度）：	260
电源：	+-5 V	认证状态：	Not Qualified
座面最大高度：	5.08 mm	子类别：	Codecs
最大压摆率：	0.011 mA	标称供电电压：	5 V
表面贴装：	NO	技术：	CMOS
电信集成电路类型：	PROGRAMMABLE CODEC	温度等级：	COMMERCIAL
端子面层：	Tin/Lead (Sn85Pb15)	端子形式：	THROUGH-HOLE
端子节距：	2.54 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	40	宽度：	7.62 mm
Base Number Matches：	1

TP3071N-G 数据手册

Company

URL for Additional Information

National Semiconductor

http://www.national.com/quality/green/

Contact

Title

Phone

Engineering Project Manager

Green.project@nsc.com

Gloria Gordon

1-408-721-8435

Part Number

MSL Rating

Peak Body Temp C

MaxTime (Sec)

Cycles

TP3071N-G

260

Document Date

Weight (mg)

Unit Type

Contains Lead(Pb) and is NOT European RoHS Compliant

NOT China RoHS Compliant

23-Sep-2007

1,430.000

Each

Homogeneous Material Composition Declaration for Electronic Products

Item

Weight (mg)

Component

CAS#

Weight (mg)

Item-ppm

Part-ppm

486,336

Plastic

1,004.710 SiO2

60676-86-0

25928-94-3

1309-64-4

695.460

692,200

Epoxy Resin

Sb2O3

291.366

9.042

8.841

369.413

9.098

0.455

0.114

35.054

6.186

3.280

0.020

0.810

0.500

0.270

0.090

290,000

9,000

203,752

6,323

6,183

258,331

6,362

318

Brominated Epoxy

40039-93-8

7440-50-8

7439-89-6

7440-66-6

7723-14-0

7440-31-5

7439-92-1

7440-21-3

7429-90-5

7440-57-5

7440-22-4

25928-94-3

8,800

Leadframe

379.080 Cu

974,500

24,000

1,200

300

Ext. LeadFinish

Chip

41.240 Sn

850,000

150,000

994,000

6,000

24,513

4,326

2,294

3.300 Si

Wires

0.810 Au

0.500 Ag

0.360 Ag

1,000,000

750,000

250,000

566

Int. LeadFinish

Die Attach

350

189

Epoxy Resin

Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing.

Additionally, the following should be noted:

1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties.

2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.

RoHS Material Composition Declaration

RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent

Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass

(100 PPM) of homogeneous material for Cadmium

RoHS Directive

2002/95/EC

Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.

1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances

2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A

threshold levels, except lead in RoHS exempt applications 5, 7a and 7c.

2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do

not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in

solder and RoHS exempt applications 5, 7a and 7c.

3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for

Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at

www.national.com/quality/green/.

4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that

Deplete the Ozone Layer and U.S. Clean Air Act, Title VI.

National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information

provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from

default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default

may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations

are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers

consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s

standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in

connection with the information provided herein unless otherwise provided by a written contract signed by both parties.

NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION.

Gerry Fields

Vice President Quality

National Semiconductor

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TP3076J	NSC	获取价格	COMBO II Programmable PCM CODEC/Filter for ISDN and Digital Phone Applications
TP3076N-G/NOPB	NSC	获取价格	IC A/MU-LAW, PROGRAMMABLE CODEC, PDIP20, Codec

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