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TNETV1647GSTZWT PDF预览

TNETV1647GSTZWT

更新时间: 2024-11-27 11:08:03
品牌 Logo 应用领域
德州仪器 - TI 外围集成电路
页数 文件大小 规格书
229页 1822K
描述
达芬奇数字媒体片上系统 | ZWT | 361

TNETV1647GSTZWT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:NFBGA-361
Reach Compliance Code:compliant风险等级:5.6
其他特性:IT ASLO OPERATES IN 1V MINIMUM SUPPLYJESD-30 代码:S-PBGA-B361
JESD-609代码:e1长度:16 mm
湿度敏感等级:3端子数量:361
最高工作温度:85 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260座面最大高度:1.4 mm
最大供电电压:1.25 V最小供电电压:1.15 V
标称供电电压:1.2 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:16 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUITBase Number Matches:1

TNETV1647GSTZWT 数据手册

 浏览型号TNETV1647GSTZWT的Datasheet PDF文件第2页浏览型号TNETV1647GSTZWT的Datasheet PDF文件第3页浏览型号TNETV1647GSTZWT的Datasheet PDF文件第4页浏览型号TNETV1647GSTZWT的Datasheet PDF文件第5页浏览型号TNETV1647GSTZWT的Datasheet PDF文件第6页浏览型号TNETV1647GSTZWT的Datasheet PDF文件第7页 
TMS320DM6441  
Digital Media System-on-Chip  
www.ti.com  
SPRS359BSEPTEMBER 2006REVISED JANUARY 2007  
1 Digital Media System-on-Chip (DMSoC)  
1.1 Features  
(Flexible RAM/Cache Allocation)  
ARM926EJ-S Core  
High-Performance Digital Media SoC  
C64x+™ DSP Clock Rate  
Support for 32-Bit and 16-Bit (Thumb®  
Mode) Instruction Sets  
405-MHz (Max) at 1.05 V or 513-MHz  
(Max) at 1.2 V  
DSP Instruction Extensions and Single  
Cycle MAC  
ARM® Jazelle® Technology  
Embedded ICE-RT™ Logic for Real-Time  
Debug  
ARM926EJ-S™ Clock Rate  
202.5-MHz (Max) at 1.05 V or 256-MHz  
(Max) at 1.2 V  
Eight 32-Bit C64x+ Instructions/Cycle  
4752 C64x+ MIPS  
Fully Software-Compatible With C64x /  
ARM9™  
ARM9 Memory Architecture  
16K-Byte Instruction Cache  
8K-Byte Data Cache  
16K-Byte RAM  
Advanced Very-Long-Instruction-Word (VLIW)  
TMS320C64x+™ DSP Core  
8K-Byte ROM  
Eight Highly Independent Functional Units  
Six ALUs (32-/40-Bit), Each Supports  
Single 32-Bit, Dual 16-Bit, or Quad 8-Bit  
Arithmetic per Clock Cycle  
Embedded Trace Buffer™ (ETB11™) With 4KB  
Memory for ARM9 Debug  
Endianness: Little Endian for ARM and DSP  
Video Processing Subsystem  
Two Multipliers Support Four 16 x 16-Bit  
Multiplies (32-Bit Results) per Clock  
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit  
Results) per Clock Cycle  
Front End Provides:  
CCD and CMOS Imager Interface  
BT.601/BT.656 Digital YCbCr 4:2:2  
(8-/16-Bit) Interface  
Load-Store Architecture With Non-Aligned  
Support  
Preview Engine for Real-Time Image  
Processing  
Glueless Interface to Common Video  
Decoders  
Histogram Module  
Auto-Exposure, Auto-White Balance,  
and Auto-Focus Module  
64 32-Bit General-Purpose Registers  
Instruction Packing Reduces Code Size  
All Instructions Conditional  
Additional C64x+™ Enhancements  
Protected Mode Operation  
Exceptions Support for Error Detection  
and Program Redirection  
Resize Engine  
Hardware Support for Modulo Loop  
Operation  
Resize Images From 1/4x to 4x  
Separate Horizontal/Vertical Control  
C64x+ Instruction Set Features  
Video Processing Subsystem (Continued)  
Back End Provides:  
Byte-Addressable (8-/16-/32-/64-Bit Data)  
8-Bit Overflow Protection  
Bit-Field Extract, Set, Clear  
Normalization, Saturation, Bit-Counting  
Compact 16-Bit Instructions  
Additional Instructions to Support Complex  
Multiplies  
Hardware On-Screen Display (OSD)  
Four 54-MHz DACs for a Combination of  
Composite NTSC/PAL Video  
Luma/Chroma Separate Video  
(S-video)  
Component (YPbPr or RGB) Video  
(Progressive)  
C64x+ L1/L2 Memory Architecture  
32K-Byte L1P Program RAM/Cache (Direct  
Mapped)  
Digital Output  
8-/16-bit YUV or up to 24-Bit RGB  
HD Resolution  
Up to Two Video Windows  
80K-Byte L1D Data RAM/Cache (2-Way  
Set-Associative)  
64K-Byte L2 Unified Mapped RAM/Cache  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2007, Texas Instruments Incorporated  

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