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TN28F020-120 PDF预览

TN28F020-120

更新时间: 2024-09-18 22:40:47
品牌 Logo 应用领域
英特尔 - INTEL 闪存存储内存集成电路
页数 文件大小 规格书
38页 877K
描述
28F020 2048K (256K X 8) CMOS FLASH MEMORY

TN28F020-120 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFJ包装说明:0.450 X 0.550 INCH, PLASTIC, LCC-32
针数:32Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.4Is Samacsys:N
最长访问时间:120 ns其他特性:MINIMUM 100K ERASE/PROGRAM CYCLES
命令用户界面:YES数据轮询:NO
耐久性:100000 Write/Erase CyclesJESD-30 代码:R-PQCC-J32
JESD-609代码:e0长度:13.97 mm
内存密度:2097152 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:32字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX8封装主体材料:PLASTIC/EPOXY
封装代码:QCCJ封装等效代码:LDCC32,.5X.6
封装形状:RECTANGULAR封装形式:CHIP CARRIER
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V编程电压:12 V
认证状态:Not Qualified座面最大高度:3.55 mm
最大待机电流:0.0001 A子类别:Flash Memories
最大压摆率:0.03 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:J BEND端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:NO类型:NOR TYPE
宽度:11.43 mmBase Number Matches:1

TN28F020-120 数据手册

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E
28F020 2048K (256K X 8) CMOS  
FLASH MEMORY  
Flash Electrical Chip-Erase  
Command Register Architecture for  
Microprocessor/Microcontroller  
Compatible Write Interface  
2 Second Typical Chip-Erase  
Quick-Pulse Programming Algorithm  
10 µS Typical Byte-Program  
4 second Chip-Program  
Noise Immunity Features  
±10% VCC Tolerance  
Maximum Latch-Up Immunity  
through EPI Processing  
100,000 Erase/Program Cycles  
12.0 V ±5% VPP  
ETOX™ Nonvolatile Flash Technology  
EPROM-Compatible Process Base  
High-Volume Manufacturing  
Experience  
High-Performance Read  
90 ns Maximum Access Time  
CMOS Low Power Consumption  
10 mA Typical Active Current  
50 µA Typical Standby Current  
0 Watts Data Retention Power  
JEDEC-Standard Pinouts  
32-Pin Plastic Dip  
32-Lead PLCC  
32-Lead TSOP  
(See Packaging Spec., Order #231369)  
Integrated Program/Erase Stop Timer  
Extended Temperature Options  
Intel’s 28F020 CMOS flash memory offers the most cost-effective and reliable alternative for read/write  
random access nonvolatile memory. The 28F020 adds electrical chip-erasure and reprogramming to familiar  
EPROM technology. Memory contents can be rewritten: in a test socket; in a PROM-programmer socket; on-  
board during subassembly test; in-system during final test; and in-system after sale. The 28F020 increases  
memory flexibility, while contributing to time and cost savings.  
The 28F020 is a 2048-kilobit nonvolatile memory organized as 262,144 bytes of eight bits. Intel’s 28F020 is  
offered in 32-pin plastic DIP, 32-lead PLCC, and 32-lead TSOP packages. Pin assignments conform to  
JEDEC standards for byte-wide EPROMs.  
Extended erase and program cycling capability is designed into Intel’s ETOX™ (EPROM Tunnel Oxide)  
process technology. Advanced oxide processing, an optimized tunneling structure, and lower electric field  
combine to extend reliable cycling beyond that of traditional EEPROMs. With the 12.0 V VPP supply, the  
28F020 performs 100,000 erase and program cycles—well within the time limits of the quick-pulse  
programming and quick-erase algorithms.  
Intel’s 28F020 employs advanced CMOS circuitry for systems requiring high-performance access speeds,  
low power consumption, and immunity to noise. Its 90 ns access time provides zero wait-state performance  
for a wide range of microprocessors and microcontrollers. Maximum standby current of 100 µA translates  
into power savings when the device is deselected. Finally, the highest degree of latch-up protection is  
achieved through Intel’s unique EPI processing. Prevention of latch-up is provided for stresses up to 100 mA  
on address and data pins, from –1 V to VCC + 1 V.  
With Intel’s ETOX process technology base, the 28F020 builds on years of EPROM experience to yield the  
highest levels of quality, reliability, and cost-effectiveness.  
December 1997  
Order Number: 290245-009  

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