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TMX320VC5505DZCH

更新时间： 2024-10-27 07:04:39
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路数字信号处理器时钟
页数 文件大小 规格书
141页 1319K
描述
Fixed-Point Digital Signal Processor

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TMX320VC5505DZCH 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：LFBGA, BGA196,14X14,25
针数：196Reach Compliance Code：unknown
HTS代码：8542.31.00.01风险等级：5.81
地址总线宽度：桶式移位器：NO
位大小：16边界扫描：YES
最大时钟频率：12 MHz外部数据总线宽度：
格式：FIXED POINT内部总线架构：MULTIPLE
JESD-30 代码：S-PBGA-B196长度：10 mm
低功率模式：YES端子数量：196
最高工作温度：70 °C最低工作温度：
封装主体材料：PLASTIC/EPOXY封装代码：LFBGA
封装等效代码：BGA196,14X14,25封装形状：SQUARE
封装形式：GRID ARRAY峰值回流温度（摄氏度）：NOT SPECIFIED
电源：1/1.4,1.8/3.3 V认证状态：Not Qualified
RAM（字数）：163840座面最大高度：1.3 mm
子类别：Digital Signal Processors最大供电电压：1.43 V
最小供电电压：1.24 V标称供电电压：1.3 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子形式：BALL
端子节距：0.65 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：10 mm
uPs/uCs/外围集成电路类型：DIGITAL SIGNAL PROCESSOR, OTHERBase Number Matches：1

TMX320VC5505DZCH 数据手册

 浏览型号TMX320VC5505DZCH的Datasheet PDF文件第2页浏览型号TMX320VC5505DZCH的Datasheet PDF文件第3页浏览型号TMX320VC5505DZCH的Datasheet PDF文件第4页浏览型号TMX320VC5505DZCH的Datasheet PDF文件第5页浏览型号TMX320VC5505DZCH的Datasheet PDF文件第6页浏览型号TMX320VC5505DZCH的Datasheet PDF文件第7页 
TMS320VC5505  
Fixed-Point Digital Signal Processor  
www.ti.com  
SPRS503A–JUNE 2009–REVISED JULY 2009  
1 Fixed-Point Digital Signal Processor  
1.1 TMS320VC5505 Features  
•
High-Performance, Low-Power, TMS320C55x™  
Fixed-Point Digital Signal Processor  
•
•
Four Inter-IC Sound (I2S Bus™) for Data  
Transport  
–
–
–
–
16.67-, 10-ns Instruction Cycle Time  
60-, 100-MHz Clock Rate  
One/Two Instruction(s) Executed per Cycle  
Dual Multipliers [Up to 200 Million  
Multiply-Accumulates per Second  
(MMACS)]  
Device USB Port With Integrated 2.0  
High-Speed PHY that Supports:  
–
USB 2.0 Full- and High-Speed Device  
•
•
•
LCD Bridge With Asynchronous Interface  
Tightly-Coupled FFT Hardware Accelerator  
10-Bit 4-Input Successive Approximation  
(SAR) ADC  
–
–
Two Arithmetic/Logic Units (ALUs)  
Three Internal Data/Operand Read Buses  
and Two Internal Data/Operand Write Buses  
•
Real-Time Clock (RTC) With Crystal Input, With  
Separate Clock Domain, Separate Power  
Supply  
–
Fully Software-Compatible With C55x  
Devices  
–
Industrial Temperature Devices Available  
•
•
•
•
Four Core Isolated Power Supply Domains:  
Analog, RTC, CPU and Peripherals, and USB  
•
320K Bytes Zero-Wait State On-Chip RAM,  
Composed of:  
–
Four I/O Isolated Power Supply Domains: RTC  
I/O, EMIF I/O, USB PHY, and DVDDIO  
64K Bytes of Dual-Access RAM (DARAM),  
8 Blocks of 4K x 16-Bit  
256K Bytes of Single-Access RAM  
(SARAM), 32 Blocks of 4K x 16-Bit  
Low-Power S/W Programmable Phase-Locked  
Loop (PLL) Clock Generator  
–
On-Chip ROM Bootloader (RBL) to Boot From  
NAND Flash, NOR Flash, SPI EEPROM, or I2C  
EEPROM  
•
•
128K Bytes of Zero Wait-State On-Chip ROM  
(4 Blocks of 16K x 16-Bit)  
16-/8-Bit External Memory Interface (EMIF) with  
Glueless Interface to:  
•
•
•
•
•
•
IEEE-1149.1 (JTAG™)  
Boundary-Scan-Compatible  
–
–
–
8-/16-Bit NAND Flash, 1- and 4-Bit ECC  
8-/16-Bit NOR Flash  
Asynchronous Static RAM (SRAM)  
Up to 26 General-Purpose I/O (GPIO) Pins  
(Multiplexed With Other Device Functions)  
196-Terminal Pb-Free Plastic BGA (Ball Grid  
Array) (ZCH Suffix)  
•
Direct Memory Access (DMA) Controller  
–
Four DMA With 4 Channels Each  
(16-Channels Total)  
1.05-V Core (60 MHz), 1.8-V, 2.5-V, 2.8-V, or  
3.3-V I/Os  
•
•
•
•
•
Three 32-Bit General-Purpose Timers  
One Selectable as a Watchdog and/or GP  
1.3-V Core (100 MHz), 1.8-V, 2.5-V, 2.8-V, or  
3.3-V I/Os  
–
Two MultiMedia Card/Secure Digital (MMC/SD)  
Interfaces  
Applications:  
–
Wireless Audio Devices (e.g., Headsets,  
Microphones, Speakerphones, etc.)  
Universal Asynchronous Receiver/Transmitter  
(UART)  
–
–
–
–
–
–
Echo Cancellation Headphones  
Portable Medical Devices  
Voice Applications  
Industrial Controls  
Fingerprint Biometrics  
Software Defined Radio  
Serial-Port Interface (SPI) With Four  
Chip-Selects  
Master/Slave Inter-Integrated Circuit (I2C  
Bus™)  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2009, Texas Instruments Incorporated  
 
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