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TMX320C5514AZCH12 PDF预览

TMX320C5514AZCH12

更新时间: 2024-11-13 06:02:51
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路数字信号处理器时钟
页数 文件大小 规格书
138页 874K
描述
TMS320C5514 Fixed-Point Digital Signal Processor

TMX320C5514AZCH12 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA, BGA196,14X14,25针数:196
Reach Compliance Code:compliant风险等级:5.15
Is Samacsys:N地址总线宽度:21
桶式移位器:NO位大小:16
边界扫描:YES最大时钟频率:12 MHz
外部数据总线宽度:16格式:FIXED POINT
内部总线架构:SINGLEJESD-30 代码:S-PBGA-B196
长度:10 mm低功率模式:YES
端子数量:196最高工作温度:70 °C
最低工作温度:-10 °C封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA196,14X14,25
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.05/1.3,1.8/3.3 V
认证状态:Not QualifiedRAM(字数):131072
座面最大高度:1.3 mm子类别:Digital Signal Processors
最大供电电压:1.15 V最小供电电压:0.998 V
标称供电电压:1.05 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:0.65 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10 mmuPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches:1

TMX320C5514AZCH12 数据手册

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TMS320C5514  
www.ti.com  
SPRS646JANUARY 2010  
TMS320C5514 Fixed-Point Digital Signal Processor  
Check for Samples: TMS320C5514  
1 Fixed-Point Digital Signal Processor  
1.1 TMS320C5514 Features  
1
• HIGHLIGHTS:  
• 16-/8-Bit External Memory Interface (EMIF) with  
Glueless Interface to:  
• High-Perf/Low-Power, C55x™ Fixed-Point DSP  
– 16.67/13.33/10/8.33-ns Instruction Cycle Time  
– 60-, 75-, 100-, 120-MHz Clock Rate  
• 256K Bytes On-Chip RAM  
• 16-/8-Bit External Memory Interface (EMIF)  
• Two MultiMedia Card/Secure Digital I/Fs  
• Serial-Port I/F (SPI) With Four Chip-Selects  
• Four Inter-IC Sound (I2S Bus™)  
• USB 2.0 Full- and High-Speed Device  
• Real-Time Clock (RTC) With Crystal Input  
• Four Core Isolated Power Supply Domains  
• Four I/O Isolated Power Supply Domains  
• Three integrated LDOs  
• Industrial Temperature Devices Available  
• 1.05-V Core, 1.8/2.5/2.8/3.3-V I/Os  
• 1.3-V Core, 1.8/2.5/2.8/3.3-V I/Os  
• FEATURES:  
• High-Performance, Low-Power, TMS320C55x™  
Fixed-Point Digital Signal Processor  
– 8-/16-Bit NAND Flash, 1- and 4-Bit ECC  
– 8-/16-Bit NOR Flash  
– Asynchronous Static RAM (SRAM)  
– SDRAM/mSDRAM (1.8-, 2,5-, and 3.3-V)  
• Direct Memory Access (DMA) Controller  
– Four DMA With 4 Channels Each  
(16-Channels Total)  
• Three 32-Bit General-Purpose Timers  
– One Selectable as a Watchdog and/or GP  
• Two MultiMedia Card/Secure Digital (MMC/SD)  
Interface s  
• Universal Asynchronous Receiver/Transmitter  
(UART)  
• Serial-Port Interface (SPI) With Four  
Chip-Selects  
• Master/Slave Inter-Integrated Circuit (I2C Bus™)  
• Four Inter-IC Sound (I2S Bus™) for Data  
Transport  
• Device USB Port With Integrated 2.0  
High-Speed PHY that Supports:  
– 16.67-, 13.33, 10-, 8.33-ns Instruction Cycle  
Time  
– 60-, 75-, 100-, 120-MHz Clock Rate  
– One/Two Instruction(s) Executed per Cycle  
– Dual Multipliers [Up to 200 or 240 Million  
Multiply-Accumulates per Second (MMACS)]  
– USB 2.0 Full- and High-Speed Device  
• Real-Time Clock (RTC) With Crystal Input, With  
Separate Clock Domain, Separate Power  
Supply  
• Four Core Isolated Power Supply Domains:  
Analog, RTC, CPU and Peripherals, and USB  
– Two Arithmetic/Logic Units (ALUs)  
– Three Internal Data/Operand Read Buses  
and Two Internal Data/Operand Write Buses  
• Four I/O Isolated Power Supply Domains: RTC  
I/O, EMIF I/O, USB PHY, and DVDDIO  
– Fully Software-Compatible With C55x  
Devices  
– Industrial Temperature Devices Available  
• Three integrated LDOs (DSP_LDO, ANA_LDO,  
and USB_LDO) to power the isolated domains:  
DSP Core, Analog, and USB Core, respectively  
• Low-Power S/W Programmable Phase-Locked  
Loop (PLL) Clock Generator  
• 256 K Bytes Zero-Wait State On-Chip RAM,  
Composed of:  
• On-Chip ROM Bootloader (RBL) to Boot From  
NAND Flash, NOR Flash, SPI EEPROM, SPI  
Serial Flash or I2C EEPROM  
– 64K Bytes of Dual-Access RAM (DARAM),  
8 Blocks of 4K x 16-Bit  
– 192K Bytes of Single-Access RAM (SARAM),  
24 Blocks of 4K x 16-Bit  
• IEEE-1149.1 (JTAG™)  
Boundary-Scan-Compatible  
• Up to 26 General-Purpose I/O (GPIO) Pins  
(Multiplexed With Other Device Functions)  
• 128K Bytes of Zero Wait-State On-Chip ROM  
(4 Blocks of 16K x 16-Bit)  
• 4M x 16-Bit Maximum Addressable External  
Memory Space (SDRAM/mSDRAM)  
• 196-Terminal Pb-Free Plastic BGA (Ball Grid  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCT PREVIEW information concerns products in the formative  
Copyright © 2010, Texas Instruments Incorporated  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
 
 

TMX320C5514AZCH12 替代型号

型号 品牌 替代类型 描述 数据表
TMS320C5514AZCH12 TI

完全替代

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