是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | HTQFP-144 | 针数: | 144 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 2.25 | Is Samacsys: | N |
其他特性: | 32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY | 地址总线宽度: | 32 |
桶式移位器: | NO | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 25 MHz |
外部数据总线宽度: | 32 | 格式: | FLOATING POINT |
集成缓存: | YES | 内部总线架构: | MULTIPLE |
JESD-30 代码: | S-PQFP-G144 | JESD-609代码: | e4 |
长度: | 20 mm | 低功率模式: | NO |
湿度敏感等级: | 4 | DMA 通道数量: | 16 |
端子数量: | 144 | 片上数据RAM宽度: | 8 |
片上程序ROM宽度: | 8 | 最高工作温度: | 105 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HTFQFP | 封装等效代码: | TQFP144,.9SQ |
封装形状: | SQUARE | 封装形式: | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.2,3.3 V |
认证状态: | Not Qualified | RAM(字数): | 131072 |
ROM可编程性: | MROM | 座面最大高度: | 1.2 mm |
子类别: | Digital Signal Processors | 最大供电电压: | 1.32 V |
最小供电电压: | 1.14 V | 标称供电电压: | 1.2 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 20 mm | uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER |
Base Number Matches: | 1 |
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