是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | HFBGA, BGA532,26X26,32 | 针数: | 532 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.67 |
Is Samacsys: | N | 其他特性: | ALSO REQUIRES 3.3VI/O SUPPLY |
地址总线宽度: | 32 | 桶式移位器: | NO |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 75.18 MHz | 外部数据总线宽度: | 64 |
格式: | FIXED POINT | 内部总线架构: | MULTIPLE |
JESD-30 代码: | S-PBGA-B532 | JESD-609代码: | e0 |
长度: | 23 mm | 低功率模式: | YES |
湿度敏感等级: | 4 | 端子数量: | 532 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HFBGA |
封装等效代码: | BGA532,26X26,32 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | 峰值回流温度(摄氏度): | 220 |
电源: | 1.2,3.3 V | 认证状态: | Not Qualified |
RAM(字数): | 16384 | 座面最大高度: | 3.3 mm |
子类别: | Digital Signal Processors | 最大供电电压: | 1.26 V |
最小供电电压: | 1.14 V | 标称供电电压: | 1.2 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 23 mm |
uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER | Base Number Matches: | 1 |
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