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TMS320DM8165SCYG4 PDF预览

TMS320DM8165SCYG4

更新时间: 2024-12-02 11:06:19
品牌 Logo 应用领域
德州仪器 - TI 控制器微控制器微控制器和处理器外围集成电路数字信号处理器
页数 文件大小 规格书
312页 2568K
描述
DaVinci 数字媒体处理器 | CYG | 1031 | 0 to 0

TMS320DM8165SCYG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:HBGA, BGA1031,37X37,25针数:1031
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.7地址总线宽度:15
桶式移位器:NO位大小:32
边界扫描:YES外部数据总线宽度:32
格式:FLOATING POINT集成缓存:YES
内部总线架构:MULTIPLEJESD-30 代码:S-PBGA-B1031
JESD-609代码:e1长度:25 mm
低功率模式:YES湿度敏感等级:4
DMA 通道数量:72端子数量:1031
计时器数量:8最高工作温度:95 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:HBGA封装等效代码:BGA1031,37X37,25
封装形状:SQUARE封装形式:GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度):245电源:1 V
认证状态:Not QualifiedRAM(字数):16384
座面最大高度:3.31 mm子类别:Digital Signal Processors
最大供电电压:1.05 V最小供电电压:0.95 V
标称供电电压:1 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.65 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:25 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, MIXEDBase Number Matches:1

TMS320DM8165SCYG4 数据手册

 浏览型号TMS320DM8165SCYG4的Datasheet PDF文件第2页浏览型号TMS320DM8165SCYG4的Datasheet PDF文件第3页浏览型号TMS320DM8165SCYG4的Datasheet PDF文件第4页浏览型号TMS320DM8165SCYG4的Datasheet PDF文件第5页浏览型号TMS320DM8165SCYG4的Datasheet PDF文件第6页浏览型号TMS320DM8165SCYG4的Datasheet PDF文件第7页 
TMS320DM8168, TMS320DM8167  
TMS320DM8166, TMS320DM8165  
www.ti.com  
SPRS614MARCH 2011  
TMS320DM816x DaVinci  
Digital Media Processors  
Check for Samples: TMS320DM8168, TMS320DM8167, TMS320DM8166, TMS320DM8165  
1 Device Summary  
1.1 Features  
1234567891011  
Multiply Supported up to:  
• High-Performance DaVinci™ Digital Media  
Processors  
2 SP x SP SP Per Clock  
– ARM® Cortex™-A8 RISC MPU  
2 SP x SP DP Every Two Clocks  
2 SP x DP DP Every Three Clocks  
2 DP x DP DP Every Four Clocks  
Up to 1.2 GHz  
– C674x VLIW DSP  
Up to 1.0 GHz  
Up to 8000/6000 C674x MIPS/MFLOPS  
Fully Software-Compatible with C67x+™  
and C64x+™  
Fixed-Point Multiply Supports Two 32 x  
32 Multiplies, Four 16 x 16-bit Multiplies  
including Complex Multiplies, or Eight 8 x  
8-Bit Multiplies per Clock Cycle  
• ARM® Cortex™-A8 Core  
– ARMv7 Architecture  
• C674x Two-Level Memory Architecture  
– 32K-Byte L1P and L1D RAM/Cache  
– 256K-Byte L2 Unified Mapped RAM/Caches  
• DSP/EDMA Memory Management Unit  
(DEMMU)  
– Maps C674x DSP and EMDA TCB Memory  
Accesses to System Addresses  
• 512K-Bytes On-Chip Memory Controller  
(OCMC) RAM  
• Up to Three Programmable High-Definition  
Video Image Coprocessing (HDVICP2) Engines  
In-Order, Dual-Issue, Superscalar  
Microprocessor Core  
NEON™ Multimedia Architecture  
– Supports Integer and Floating Point  
(VFPv3-IEEE754 compliant)  
Jazelle® RCT Execution Environment  
• ARM® Cortex™-A8 Memory Architecture  
– 32K-Byte Instruction and Data Caches  
– 256K-Byte L2 Cache  
– Encode, Decode, Transcode Operations  
– H.264, MPEG2, VC1, MPEG4 SP/ASP  
• SGX530 3D Graphics Engine (available only on  
the DM8168/DM8166 device)  
– 64K-Byte RAM, 48K-Byte Boot ROM  
• TMS320C674x Floating-Point VLIW DSP  
– 64 General-Purpose Registers (32-Bit)  
– Six ALU (32-/40-Bit) Functional Units  
– Delivers up to 30 MTriangles/s  
Supports 32-Bit Integer, SP (IEEE Single  
Precision/32-Bit) and DP (IEEE Double  
Precision/64-Bit) Floating Point  
Supports up to Four SP Adds Per Clock  
and Four DP Adds Every Two Clocks  
Supports up to Two Floating-Point (SP or  
DP) Approximate Reciprocal or Square  
Root Operations Per Cycle  
– Universal Scalable Shader Engine  
– Direct3D® Mobile, OpenGL® ES 1.1 and 2.0,  
OpenVG™ 1.0, OpenMax™ API Support  
– Advanced Geometry DMA Driven Operation  
– Programmable HQ Image Anti-Aliasing  
• Endianness  
– ARM/DSP Instructions/Data – Little Endian  
• HD Video Processing Subsystem (HDVPSS)  
– Two 165 MHz HD Video Capture Channels  
– Two Multiply Functional Units  
Mixed-Precision IEEE Floating-Point  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
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6
7
8
9
DaVinci, C64x+, SmartReflex, TMS320C6000, Code Composer Studio, DSP/BIOS, XDS are trademarks of Texas Instruments.  
Cortex, NEON are trademarks of ARM Ltd or its subsidiaries.  
ARM, Jazelle, Thumb are registered trademarks of ARM Ltd or its subsidiaries.  
USSE, POWERVR are trademarks of Imagination Technologies Limited.  
OpenVG, OpenMax are trademarks of Khronos Group Inc.  
Direct3D, Microsoft, Windows are registered trademarks of Microsoft Corporation in the United States and/or other countries.  
I2C BUS is a registered trademark of NXP B.V. Corporation Netherlands.  
PCI Express, PCIe are registered trademarks of PCI-SIG.  
10OpenGL is a registered trademark of Silicon Graphics International Corp. or its subsidiaries in the United States and/or other countries.  
11All other trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the formative  
Copyright © 2011, Texas Instruments Incorporated  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
 
 

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