生命周期: | Active | 零件包装代码: | BGA |
包装说明: | FBGA, BGA625,25X25,32 | 针数: | 625 |
Reach Compliance Code: | compliant | 风险等级: | 5.64 |
地址总线宽度: | 24 | 桶式移位器: | NO |
位大小: | 32 | 边界扫描: | YES |
外部数据总线宽度: | 16 | 格式: | FLOATING POINT |
集成缓存: | YES | 内部总线架构: | MULTIPLE |
JESD-30 代码: | S-PBGA-B625 | JESD-609代码: | e1 |
长度: | 21 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | DMA 通道数量: | 72 |
端子数量: | 625 | 计时器数量: | 8 |
片上数据RAM宽度: | 8 | 片上程序ROM宽度: | 8 |
最高工作温度: | 85 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA625,25X25,32 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, FINE PITCH | 峰值回流温度(摄氏度): | 245 |
电源: | 1,1.5,1.8 V | 认证状态: | Not Qualified |
RAM(字数): | 8192 | ROM可编程性: | MROM |
座面最大高度: | 2.99 mm | 子类别: | Digital Signal Processors |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 21 mm | uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TMS320C6670 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670ACYP2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670ACYPA | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670ACYPA2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYP | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYP2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYPA | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYPA2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670CYP | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670CYP2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip |