是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | BGA-625 | 针数: | 625 |
Reach Compliance Code: | compliant | ECCN代码: | 5A991.B.1 |
HTS代码: | 8542.31.00.01 | 风险等级: | 1.52 |
Is Samacsys: | N | 地址总线宽度: | 24 |
桶式移位器: | NO | 位大小: | 32 |
边界扫描: | YES | 外部数据总线宽度: | 16 |
格式: | FLOATING POINT | 集成缓存: | YES |
内部总线架构: | MULTIPLE | JESD-30 代码: | S-PBGA-B625 |
JESD-609代码: | e1 | 长度: | 21 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
DMA 通道数量: | 72 | 端子数量: | 625 |
计时器数量: | 8 | 片上数据RAM宽度: | 8 |
片上程序ROM宽度: | 8 | 最高工作温度: | 100 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, FINE PITCH | 峰值回流温度(摄氏度): | 245 |
ROM可编程性: | MROM | 座面最大高度: | 2.99 mm |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 21 mm | uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TMS320C6657CZH25 | TI |
类似代替 |
Fixed and Floating-Point Digital Signal Processor |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TMS320C6657GZHA | TI |
获取价格 |
Fixed and Floating-Point Digital Signal Processor | |
TMS320C6657SCZH | TI |
获取价格 |
Fixed and Floating-Point Digital Signal Processor | |
TMS320C6670 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670ACYP2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670ACYPA | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670ACYPA2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYP | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYP2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYPA | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip | |
TMS320C6670AXCYPA2 | TI |
获取价格 |
Multicore Fixed and Floating-Point System-on-Chip |