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TMS320C6472ECTZ7

更新时间： 2024-10-28 12:16:07
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路数字信号处理器时钟
页数 文件大小 规格书
269页 1414K
描述
TMS320C6472 Fixed-Point Digital Signal Processor

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TMS320C6472ECTZ7 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：FCBGA-737针数：737
Reach Compliance Code：compliantECCN代码：3A001.A.3
HTS代码：8542.31.00.01Factory Lead Time：6 weeks
风险等级：5.22Is Samacsys：N
地址总线宽度：14桶式移位器：NO
位大小：32边界扫描：YES
最大时钟频率：50 MHz外部数据总线宽度：32
格式：FIXED POINT集成缓存：YES
内部总线架构：MULTIPLEJESD-30 代码：S-PBGA-B737
JESD-609代码：e1长度：24 mm
低功率模式：YES湿度敏感等级：4
DMA 通道数量：64端子数量：737
计时器数量：14片上数据RAM宽度：8
片上程序ROM宽度：8最高工作温度：85 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：FBGA封装等效代码：BGA737,29X29,32
封装形状：SQUARE封装形式：GRID ARRAY, FINE PITCH
峰值回流温度（摄氏度）：245电源：1.1,1.8,3.3 V
认证状态：Not QualifiedRAM（字数）：8192
ROM可编程性：MROM座面最大高度：3.242 mm
子类别：Digital Signal Processors最大供电电压：1.05 V
最小供电电压：0.95 V标称供电电压：1 V
表面贴装：YES技术：CMOS
温度等级：OTHER端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.8 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：24 mmuPs/uCs/外围集成电路类型：DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches：1

TMS320C6472ECTZ7 数据手册

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TMS320C6472  
www.ti.com  
SPRS612G–JUNE 2009–REVISED JULY 2011  
TMS320C6472 Fixed-Point Digital Signal Processor  
1 Features  
1
Congestion Control  
IEEE 1149.6 Compliant I/Os  
– UTOPIA  
• Six On-Chip TMS320C64x+ Megamodules  
• Endianess: Little Endian, Big Endian  
• C64x+ Megamodule Main Features:  
•
•
•
UTOPIA Level 2 Slave ATM Controller  
8/16-Bit Transmit and Receive  
– High-Performance, Fixed-Point  
TMS320C64x+ DSP  
Operations up to 50 MHz per Direction  
– 500/625/700 MHz  
•
User-Defined Cell Format up to 64 Bytes  
– Eight 32-Bit Instructions/Cycle  
– 4000 MIPS/MMACS (16-Bits) at 500 MHz  
– Dedicated SPLOOP Instruction  
– Compact Instructions (16-Bit)  
– Instruction Set Enhancements  
– Exception Handling  
– Two 10/100/1000 Mb/s Ethernet MACs  
(EMACs)  
•
•
Both EMACs are IEEE 802.3 Compliant  
EMAC0 Supports:  
–
–
MII, RMII, SS-SMII, GMII, and RGMII  
8 Independent Transmit (TX)  
Channels  
– L1/L2 Memory Architecture:  
•
•
•
256K-Bit (32K-Byte) L1P Program  
RAM/Cache [Direct Mapped, Flexible  
Allocation]  
256K-Bit (32K-Byte) L1D RAM/Cache  
[2-Way Set-Associative, Flexible  
Allocation]  
4.75M-Bit (608K-Byte) L2 Unified Mapped  
RAM/Cache [4-Way Set-Associative,  
Flexible Allocation]  
–
8 Independent Receive (RX)  
Channels  
•
EMAC1 Supports:  
–
–
RMII, SS-SMII and RGMII  
8 Independent Transmit (TX)  
Channels  
–
8 Independent Receive (RX)  
Channels  
•
•
•
L1P Memory Controller  
L1D Memory Controller  
L2 Memory Controller  
•
Both EMACs (EMAC0 and EMAC1) Share  
MDIO Interface  
– 16-Bit Host-Port Interface (HPI)  
– One Inter-Integrated Circuit (I2C) Bus  
– Six Shared 64-Bit General-Purpose Timers  
• System PLL and PLL Controller  
– Time Stamp Counter  
– One 64-Bit General-Purpose/Watchdog Timer  
• Shared Peripherals and Interfaces  
• Secondary PLL and PLL Controller, Dedicated  
– EDMA Controller  
to EMAC  
(64 Independent Channels)  
• Third PLL and PLL Controller Dedicated to  
DDR2 Memory Controller  
• 16 General-Purpose I/O (GPIO) Pins  
• IEEE-1149.1 (JTAG™)  
Boundary-Scan-Compatible  
• 737-Pin Ball Grid Array (BGA) Package  
(CTZ or ZTZ Suffix), 0.8-mm Ball Pitch  
• 0.09-μm/7-Level Cu Metal Process (CMOS)  
• 3.3-, 1.8-, 1.5-, 1.2-V I/O Supplies  
• 1.0-/1.1-, 1.2-V Core Supplies  
• Commercial Temperature [0°C to 85°C]  
• Extended Temperature [-40°C to 100°C]  
– Shared Memory Architecture  
•
•
•
Shared L2 Memory Controller  
768K-Byte of RAM  
Boot ROM  
– Three Telecom Serial Interface Ports (TSIPs)  
•
Each TSIP is 8 Links of 8 Mbps per  
Direction  
– 32-Bit DDR2 Memory Controller (DDR2-533  
SDRAM)  
•
256 M-Byte x 2 Addressable Memory  
Space  
– Two 1x Serial RapidIO® Links,  
v1.2 Compliant  
•
•
1.25-, 2.5-, 3.125-Gbps Link Rates  
Message Passing, DirectIO Support,  
Error Management Extensions, and  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCT PREVIEW information concerns products in the formative  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
Copyright © 2009–2011, Texas Instruments Incorporated  
 
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TMS320C6472ECTZ7 替代型号

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