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TMS320C6454BGTZ PDF预览

TMS320C6454BGTZ

更新时间: 2024-10-28 12:16:07
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路数字信号处理器时钟
页数 文件大小 规格书
232页 1246K
描述
Fixed-Point Digital Signal Processor

TMS320C6454BGTZ 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:FBGA, BGA697,29X29,32针数:697
Reach Compliance Code:not_compliantECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.75
Is Samacsys:N地址总线宽度:32
桶式移位器:NO位大小:32
边界扫描:YES最大时钟频率:50 MHz
外部数据总线宽度:32格式:FIXED POINT
内部总线架构:MULTIPLEJESD-30 代码:S-PBGA-B697
JESD-609代码:e0长度:24 mm
低功率模式:YES湿度敏感等级:4
端子数量:697最高工作温度:90 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA697,29X29,32
封装形状:SQUARE封装形式:GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度):220电源:1.25,1.8,3.3 V
认证状态:Not QualifiedRAM(字数):262144
座面最大高度:3.242 mm子类别:Digital Signal Processors
最大供电电压:1.2875 V最小供电电压:1.2125 V
标称供电电压:1.25 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:24 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHERBase Number Matches:1

TMS320C6454BGTZ 数据手册

 浏览型号TMS320C6454BGTZ的Datasheet PDF文件第2页浏览型号TMS320C6454BGTZ的Datasheet PDF文件第3页浏览型号TMS320C6454BGTZ的Datasheet PDF文件第4页浏览型号TMS320C6454BGTZ的Datasheet PDF文件第5页浏览型号TMS320C6454BGTZ的Datasheet PDF文件第6页浏览型号TMS320C6454BGTZ的Datasheet PDF文件第7页 
TMS320C6454  
www.ti.com  
SPRS311I APRIL 2006REVISED MARCH 2012  
TMS320C6454  
Fixed-Point Digital Signal Processor  
Check for Samples: TMS320C6454  
1 Features  
12  
– Interfaces to DDR2-533 SDRAM  
– 32-Bit/16-Bit, 533-MHz (data rate) Bus  
– 512M-Byte Total Addressable External  
Memory Space  
• High-Performance Fixed-Point DSP (C6454)  
– 1.39-, 1.17-, and 1-ns Instruction Cycle Time  
– 720-MHz, 850-MHz, and 1-GHz Clock Rate  
– Eight 32-Bit Instructions/Cycle  
– 8000 MIPS/MMACS (16-Bits)  
– Commercial Temperature [0°C to 90°C]  
– Extended Temperature [-40°C to 105°C]  
• TMS320C64x+™ DSP Core  
• EDMA3 Controller (64 Independent Channels)  
• 32-/16-Bit Host-Port Interface (HPI)  
• 32-Bit 33-/66-MHz, 3.3-V Peripheral Component  
Interconnect (PCI) Master/Slave Interface  
Conforms to PCI Local Bus Specification (v2.3)  
– Dedicated SPLOOP Instruction  
– Compact Instructions (16-Bit)  
– Instruction Set Enhancements  
– Exception Handling  
• One Inter-Integrated Circuit (I2C) Bus  
• Two McBSPs  
• 10/100/1000 Mb/s Ethernet MAC (EMAC)  
– IEEE 802.3 Compliant  
• TMS320C64x+ Megamodule L1/L2 Memory  
Architecture:  
– Supports Multiple Media Independent  
Interfaces (MII, GMII, RMII, and RGMII)  
– 8 Independent Transmit (TX) and  
8 Independent Receive (RX) Channels  
– 256K-Bit (32K-Byte) L1P Program Cache  
[Direct Mapped]  
– 256K-Bit (32K-Byte) L1D Data Cache  
[2-Way Set-Associative]  
– 8M-Bit (1048K-Byte) L2 Unified Mapped  
RAM/Cache [Flexible Allocation]  
– 256K-Bit (32K-Byte) L2 ROM  
– Time Stamp Counter  
• Two 64-Bit General-Purpose Timers,  
Configurable as Four 32-Bit Timers  
• 16 General-Purpose I/O (GPIO) Pins  
• System PLL and PLL Controller  
• Secondary PLL and PLL Controller, Dedicated  
to EMAC and DDR2 Memory Controller  
• Advanced Event Triggering (AET) Compatible  
• Trace-Enabled Device  
• IEEE-1149.1 (JTAG™) Boundary-Scan-  
Compatible  
• 697-Pin Ball Grid Array (BGA) Package  
(CTZ, GTZ, or ZTZ Suffix), 0.8-mm Ball Pitch  
• 0.09-μm/7-Level Cu Metal Process (CMOS)  
• 3.3-/1.8-/1.5-V I/Os,  
1.25-/1.2-V Internal  
• Endianess: Little Endian, Big Endian  
• 64-Bit External Memory Interface (EMIFA)  
– Glueless Interface to Asynchronous  
Memories (SRAM, Flash, and EEPROM) and  
Synchronous Memories (SBSRAM, ZBT  
SRAM)  
– Supports Interface to Standard Sync Devices  
and Custom Logic  
(FPGA, CPLD, ASICs, etc.)  
– 32M-Byte Total Addressable External  
Memory Space  
• Pin-Compatible with the TMS320C6455 Fixed-  
Point Digital Signal Processor  
• DDR2 Memory Controller  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2006–2012, Texas Instruments Incorporated  
 

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