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TMS320C6452ZUT9 PDF预览

TMS320C6452ZUT9

更新时间: 2024-10-28 11:58:23
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路数字信号处理器时钟
页数 文件大小 规格书
181页 1260K
描述
TMS320C6452 Digital Signal Processor

TMS320C6452ZUT9 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:HFBGA, BGA529,23X23,32针数:529
Reach Compliance Code:not_compliantECCN代码:3A001.A.3
HTS代码:8542.31.00.01Factory Lead Time:1 week
风险等级:5.71Is Samacsys:N
其他特性:CAN ALSO REQUIRES WITH 1.8V I/O SUPPLY地址总线宽度:32
桶式移位器:NO位大小:32
边界扫描:YES最大时钟频率:66 MHz
外部数据总线宽度:32格式:FIXED POINT
集成缓存:YES内部总线架构:MULTIPLE
JESD-30 代码:S-PBGA-B529JESD-609代码:e1
长度:19 mm低功率模式:YES
湿度敏感等级:4DMA 通道数量:72
端子数量:529计时器数量:8
片上程序ROM宽度:8最高工作温度:90 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:HFBGA封装等效代码:BGA529,23X23,32
封装形状:SQUARE封装形式:GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
峰值回流温度(摄氏度):245电源:1.2,1.8,3.3 V
认证状态:Not QualifiedRAM(字数):32768
ROM可编程性:MROM座面最大高度:3.1 mm
子类别:Digital Signal Processors最大供电电压:1.26 V
最小供电电压:1.14 V标称供电电压:1.2 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:19 mmuPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches:1

TMS320C6452ZUT9 数据手册

 浏览型号TMS320C6452ZUT9的Datasheet PDF文件第2页浏览型号TMS320C6452ZUT9的Datasheet PDF文件第3页浏览型号TMS320C6452ZUT9的Datasheet PDF文件第4页浏览型号TMS320C6452ZUT9的Datasheet PDF文件第5页浏览型号TMS320C6452ZUT9的Datasheet PDF文件第6页浏览型号TMS320C6452ZUT9的Datasheet PDF文件第7页 
TMS320C6452  
www.ti.com  
SPRS371F OCTOBER 2007REVISED APRIL 2012  
TMS320C6452 Digital Signal Processor  
Check for Samples: TMS320C6452  
1 Features  
1
– 256K-bit (32K-byte) L1P Program RAM/Cache  
[Direct Mapped]  
– 256K-bit (32K-byte) L1D Data RAM/Cache  
[2-Way Set-Associative]  
– 1408KB L2 Unified Mapped RAM/Cache  
[Flexible Allocation]  
• High-Performance Digital Media Processor  
– 720-MHz, 900-MHz C64x+™ Clock Rates  
– 1.39 ns (-720), 1.11 ns (-900) Instruction  
Cycle Time  
– 5760, 7200 MIPS  
– Eight 32-Bit C64x+ Instructions/Cycle  
– Fully Software-Compatible With C64x/Debug  
– Commercial Temperature Ranges (-720, -900  
only)  
• Supports Little Endian Mode Only  
• External Memory Interfaces (EMIFs)  
– 32-Bit DDR2 SDRAM Memory Controller With  
512M-Byte Address Space (1.8-V I/O)  
– Asynchronous 16-Bit Wide EMIF (EMIFA)  
– Industrial Temperature Ranges (-720, -900  
only)  
Up to 128M-Byte Total Address Reach  
64M-Byte Address Reach per CE Space  
• VelociTI.2™ Extensions to VelociTI™  
Advanced Very-Long-Instruction-Word (VLIW)  
TMS320C64x+™ DSP Core  
– Glueless Interface to Asynchronous  
Memories (SRAM, Flash, and EEPROM)  
– Synchronous Memories (SBSRAM and ZBT  
SRAM)  
– Supports Interface to Standard Sync Devices  
and Custom Logic (FPGA, CPLD, ASICs,  
etc.)  
– Eight Highly Independent Functional Units  
With VelociTI.2 Extensions:  
Six ALUs (32-/40-Bit), Each Supports  
Single 32-bit, Dual 16-bit, or Quad 8-bit  
Arithmetic per Clock Cycle  
Two Multipliers Support Four 16 x 16-bit  
Multiplies (32-bit Results) per Clock Cycle  
or Eight 8 x 8-bit Multiplies (16-Bit  
Results) per Clock Cycle  
• Enhanced Direct-Memory-Access (EDMA)  
Controller (64 Independent Channels)  
• 3-Port Gigabit Ethernet Switch Subsystem  
– Load-Store Architecture With Non-Aligned  
Support  
• Four 64-Bit General-Purpose Timers (Each  
Configurable as Two 32-Bit Timers)  
– 64 32-bit General-Purpose Registers  
– Instruction Packing Reduces Code Size  
– All Instructions Conditional  
• One UART (With RTS and CTS Flow Control)  
• One 4-wire Serial Port Interface (SPI) With Two  
Chip-Selects  
– Additional C64x+™ Enhancements  
• Master/Slave Inter-Integrated Circuit (I2C  
Bus™)  
• Two Telecom Serial Interface Ports (TSIP0/1)  
• Multichannel Audio Serial Port (McASP)  
– Ten Serializers and SPDIF (DIT) Mode  
• 16/32-Bit Host-Port Interface (HPI)  
Protected Mode Operation  
Exceptions Support for Error Detection  
and Program Redirection  
Hardware Support for Modulo Loop Auto-  
Focus Module Operation  
• C64x+ Instruction Set Features  
– Byte-Addressable (8-/16-/32-/64-bit Data)  
– 8-bit Overflow Protection  
• Advanced Event Triggering (AET) Compatible  
• 32-Bit 33-/66-MHz, 3.3-V Peripheral Component  
Interconnect (PCI) Master/Slave Interface  
Conforms to PCI Specification 2.3  
– Bit-Field Extract, Set, Clear  
• VLYNQ™ Interface (FPGA Interface)  
• On-Chip ROM Bootloader  
• Individual Power-Saving Modes  
• Flexible PLL Clock Generators  
• IEEE-1149.1 (JTAG™) Boundary-Scan-  
Compatible  
– Normalization, Saturation, Bit-Counting  
– VelociTI.2 Increased Orthogonality  
– C64x+ Extensions  
Compact 16-bit Instructions  
Additional Instructions to Support  
Complex Multiplies  
• 32 General-Purpose I/O (GPIO) Pins  
• C64x+ L1/L2 Memory Architecture  
(Multiplexed With Other Device Functions)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2007–2012, Texas Instruments Incorporated  
 

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