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TMPA0503S-3R3MN-D PDF预览

TMPA0503S-3R3MN-D

更新时间: 2024-11-14 00:51:11
品牌 Logo 应用领域
台庆 - TAI-TECH /
页数 文件大小 规格书
3页 482K
描述
SMD Power Inductor

TMPA0503S-3R3MN-D 数据手册

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P2  
TAI-TECH  
TMPA0503S-Series(N)-D  
SMD Power Inductor  
1. Features  
1. Shielded construction.  
2. Capable of corresponding high frequency .  
3. Low loss realized with low DCR.  
Halogen  
4. High performance (Isat) realized by metal dust core.  
5. Ultra low buzz noise, due to composite construction.  
6. 100% Lead(Pb)-Free and RoHS compliant.  
7. Operating temperature -40~+125(Including self - temperature rise)  
Halogen-free  
2. Applications  
1. DC/DC converters in distributed power systems.  
2. DC/DC converter for Field Programmable Gate Array(FPGA).  
3. Battery powered devices.  
4. Thin type on-board power supply module for exchanger.  
5. VRM for server.  
6. High current, low profile POL converters.  
7. PDA/notebook/desktop/server and battery powered devices.  
3. Dimensions  
Recommend PC Board Pattern  
C
A
A`  
L
D
4R7  
1840  
G
L(mm)  
G(mm)  
H(mm)  
Series  
A
A`  
B
C
D
E
6.0  
2.8  
2.5  
TMPA0503 5.7±0.3 5.2±0.3 5.2±0.2 2.8±0.2 1.0±0.3 2.0±0.2  
Note: 1. The above PCB layout reference only.  
2. Recommend solder paste thickness at  
0.12mm and above.  
Unit:mm  
4. Part Numbering  
TMPA  
0503  
B
S
C
-
4R7  
D
MN  
E
-
D
F
A
A: Series  
B: Dimension  
C: Type  
BxC  
Standard.  
D: Inductance  
E: Inductance Tolerance  
F: Code  
R10=0.1uh4R7=4.7uh100=10uh101=100uh102=1000uh.  
M=±20%N=±25%Y=±30%  
Marking: Black.4R7 and 1840(18YY, 40 WW,follow production date).  

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