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TLV824ID PDF预览

TLV824ID

更新时间： 2024-11-07 22:36:59
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路光电二极管
页数 文件大小 规格书
7页 107K
描述
OPERATIONAL AMPLIFIERS

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中文翻译

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TLV824ID 技术参数

生命周期：Obsolete零件包装代码：SOIC
包装说明：PLASTIC, SOIC-14针数：14
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.33.00.01风险等级：5.84
Is Samacsys：N放大器类型：OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)：0.14 µA标称共模抑制比：73 dB
最大输入失调电压：4000 µVJESD-30 代码：R-PDSO-G14
长度：8.65 mm功能数量：4
端子数量：14最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装形状：RECTANGULAR
封装形式：SMALL OUTLINE认证状态：Not Qualified
座面最大高度：1.75 mm标称压摆率：2 V/us
子类别：Operational Amplifier供电电压上限：5.5 V
标称供电电压 (Vsup)：2.7 V表面贴装：YES
温度等级：INDUSTRIAL端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
标称均一增益带宽：7000 kHz宽度：3.9 mm
Base Number Matches：1

TLV824ID 数据手册

 浏览型号TLV824ID的Datasheet PDF文件第2页浏览型号TLV824ID的Datasheet PDF文件第3页浏览型号TLV824ID的Datasheet PDF文件第4页浏览型号TLV824ID的Datasheet PDF文件第5页浏览型号TLV824ID的Datasheet PDF文件第6页浏览型号TLV824ID的Datasheet PDF文件第7页 
TLV821 SINGLE/TLV822 DUAL/TLV824 QUAD  
OPERATIONAL AMPLIFIERS  
SLOS296A – FEBRUARY 2000 – REVISED MAY 2000  
TLV824 . . . D OR PW PACKAGE  
(TOP VIEW)  
2.7-V and 5-V Performance  
No Crossover Distortion  
Low Supply Current at V  
= 5 V:  
CC+  
4OUT  
4IN–  
4IN+  
GND  
3IN+  
3IN–  
3OUT  
1OUT  
1IN–  
1IN+  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
TLV821 . . . 0.3 mA Typ  
TLV822 . . . 0.5 mA Typ  
TLV824 . . . 1 mA Typ  
V
CC+  
Rail-to-Rail Output Swing  
2IN+  
2IN–  
Pin-to-Pin Compatible with LMV821,  
LMV822, and LMV824 Devices  
8
2OUT  
Package Options Include Plastic  
Small-Outline (D), Small-Outline Transistor  
(SOT-23 DBV, SC-70 DCK), and Thin Shrink  
Small-Outline (PW) Packages  
TLV822 . . . D OR PW PACKAGE  
(TOP VIEW)  
1OUT  
1IN –  
1IN+  
GND  
V
CC+  
1
2
3
4
8
7
6
5
description  
2OUT  
2IN –  
2IN+  
The TLV821, TLV822, and TLV824 devices are  
low-voltage (2.5 V to 5.5 V) low-power operational  
amplifiers, designed to be functionally and  
pin-to-pin compatible with the LMV821, LMV822,  
and LMV824 devices. Electrical characteristics  
are very similar to the LMV3xx operational  
amplifiers (low supply current, rail-to-rail outputs,  
input common-mode range, which includes  
ground). The TLV8xx devices have a significantly  
higher bandwidth (8 MHz typically) and a 2.5-V/ s  
slew rate. The TLV821 is a single, the TLV822 is  
a dual, and the TLV824 is a quad operational  
amplifier.  
TLV821 . . . DBV OR DCK PACKAGE  
(TOP VIEW)  
IN+  
GND  
IN–  
V
1
2
3
5
4
CC+  
OUT  
These devices are the most cost-effective solution for applications requiring low-voltage/low-power operation  
and space-saving considerations. The TLV821 is available in the ultra-small DCK package, which is  
approximately half the size of the DBV package. The DCK package saves space on PC boards and enables  
the design of small portable electronic devices (cordless and cellular phones, laptops, PDAs, PCMIAs). It also  
allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal  
integrity.  
The TLV821I, TLV822I, and TLV824I devices are characterized for operation from –40°C to 85°C.  
symbol (each amplifier)  
_
IN–  
OUT  
IN+  
+
Copyright 2000, Texas Instruments Incorporated  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567

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