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TLV4113-EP

更新时间： 2024-09-16 12:47:11
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德州仪器 - TI 运算放大器输出元件驱动
页数 文件大小 规格书
25页 884K
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HIGH-OUTPUT-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN

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TLV4110-EP, TLV4111-EP  
TLV4112-EP, TLV4113-EP  
www.ti.com............................................................................................................................................................... SGLS314D–JUNE 2006–REVISED MAY 2008  
HIGH-OUTPUT-DRIVE OPERATIONAL AMPLIFIERS  
WITH SHUTDOWN  
1
FEATURES  
TLV4112  
D OR DGN PACKAGE  
(TOP VIEW)  
23  
•
Controlled Baseline  
–
–
–
One Assembly Site  
One Test Site  
1OUT  
1IN−  
1IN+  
GND  
VDD  
1
2
3
4
8
7
6
5
One Fabrication Site  
2OUT  
2IN−  
2IN+  
•
Extended Temperature Performance of  
–55°C to 125°C  
•
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
P0029-01  
•
•
•
•
•
•
•
•
•
Enhanced Product-Change Notification  
DESCRIPTION  
(1)  
Qualification Pedigree  
The TLV411x single-supply operational amplifiers  
provide output currents in excess of 300 mA at 5 V.  
This enables standard pin-out amplifiers to be used  
as high current buffers or in coil driver applications.  
The TLV4110 and TLV4113 come with a shutdown  
feature.  
High Output Drive . . . >300 mA  
Rail-To-Rail Output  
Unity-Gain Bandwidth . . . 2.7 MHz  
Slew Rate . . . 1.5 V/µs  
Supply Current . . . 700 µA/Per Channel  
Supply Voltage Range . . . 2.5 V to 6 V  
Universal Op Amp EVM  
The TLV411x is available in the ultra-small MSOP  
PowerPAD™ package, which offers the exceptional  
thermal impedance required for amplifiers delivering  
high current levels.  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
All TLV411x devices are offered in SOIC (single and  
dual) and MSOP PowerPAD (dual).  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
FAMILY PACKAGE TABLE  
PACKAGE TYPES  
MSOP SOIC  
NUMBER OF  
CHANNELS  
DEVICE  
SHUTDOWN  
UNIVERSAL EVM BOARD  
TLV4110  
TLV4111  
TLV4112  
TLV4113  
1
1
2
2
8
8
Yes  
–
8
8
8
8
See the EVM Selection Guide (SLOU060)  
–
10  
14  
Yes  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
PowerPAD is a trademark of Texas Instruments.  
Parts, Microsim PSpice are trademarks of MicroSim Corporation.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2008, Texas Instruments Incorporated  
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