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TLV4112DGN PDF预览

TLV4112DGN

更新时间： 2024-11-18 22:49:43
品牌 Logo 应用领域
德州仪器 - TI 运算放大器输出元件驱动
页数 文件大小 规格书
21页 397K
描述
FAMILY OF HIGH OUTPUT DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN

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中文翻译

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TLV4112DGN 技术参数

生命周期：Obsolete零件包装代码：MSOP
包装说明：PLASTIC, MSOP-8针数：8
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.33.00.01风险等级：5.53
放大器类型：OPERATIONAL AMPLIFIER架构：VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)：0.0001 µA25C 时的最大偏置电流 (IIB)：0.00005 µA
标称共模抑制比：63 dB频率补偿：YES
最大输入失调电压：4000 µVJESD-30 代码：S-PDSO-G8
长度：3 mm低-偏置：YES
低-失调：NO微功率：NO
功能数量：2端子数量：8
最高工作温度：70 °C最低工作温度：
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装等效代码：TSSOP8,.19封装形状：SQUARE
封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH功率：YES
电源：3/5 V可编程功率：NO
认证状态：Not Qualified座面最大高度：1.07 mm
最小摆率：0.55 V/us标称压摆率：1.57 V/us
子类别：Operational Amplifier最大压摆率：3 mA
供电电压上限：6 V标称供电电压 (Vsup)：3 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
标称均一增益带宽：2700 kHz最小电压增益：2200
宽带：NO宽度：3 mm
Base Number Matches：1

TLV4112DGN 数据手册

 浏览型号TLV4112DGN的Datasheet PDF文件第2页浏览型号TLV4112DGN的Datasheet PDF文件第3页浏览型号TLV4112DGN的Datasheet PDF文件第4页浏览型号TLV4112DGN的Datasheet PDF文件第5页浏览型号TLV4112DGN的Datasheet PDF文件第6页浏览型号TLV4112DGN的Datasheet PDF文件第7页 
TLV4110, TLV4111, TLV4112, TLV4113  
FAMILY OF HIGH OUTPUT DRIVE OPERATIONAL  
AMPLIFIERS WITH SHUTDOWN  
SLOS289A – DECEMBER 1999 – REVISED APRIL 2000  
TLV4112  
D, DGN, OR P PACKAGE  
(TOP VIEW)  
High Output Drive . . . >300 mA  
Rail-To-Rail Output  
Unity-Gain Bandwidth . . . 2 MHz  
Slew Rate . . . 1.5 V/µs  
1OUT  
1IN–  
1IN+  
GND  
V
DD  
1
2
3
4
8
7
6
5
2OUT  
2IN–  
2IN+  
Supply Current . . . 700-µA/Per Channel  
Supply Voltage Range . . . 2.5 V to 6 V  
Specified Temperature Range:  
– T = 0°C to 70°C . . . Commercial Grade  
A
– T = –40°C to 125°C . . . Industrial Grade  
A
Universal OpAmp EVM  
description  
The TLV411x single supply operational amplifiers provide output currents in excess of 300 mA at 5 V. This  
enables standard pin-out amplifiers to be used as high current buffers or in coil driver applications. The TLV4110  
and TLV4113 comes with a shutdown feature.  
The TLV411x is available in the ultra small MSOP PowerPAD package, which offers the exceptional thermal  
impedance required for amplifiers delivering high current levels.  
All TLV411x devices are offered in PDIP, SOIC (single and dual) and MSOP PowerPAD (dual).  
FAMILY PACKAGE TABLE  
PACKAGE TYPES  
NUMBER OF  
CHANNELS  
UNIVERSAL  
EVM BOARD  
DEVICE  
SHUTDOWN  
MSOP  
PDIP  
SOIC  
†
TLV4110  
1
1
2
2
8
8
8
8
8
8
Yes  
—
Refer to the EVM  
Selection Guide  
(Lit# SLOU060)  
†
TLV4111  
TLV4112  
TLV4113  
8
8
8
—
†
10  
14  
14  
Yes  
†
This device is in the Product Preview stage of development. Contact the local TI sales office for more  
information.  
HIGH-LEVEL OUTPUT VOLTAGE  
vs  
LOW-LEVEL OUTPUT VOLTAGE  
vs  
HIGH-LEVEL OUTPUT CURRENT  
LOW-LEVEL OUTPUT CURRENT  
3.0  
2.9  
1.0  
0.9  
0.8  
V
= 3 V  
DD  
V
= 3 V  
DD  
T
= 70°C  
2.8  
2.7  
2.6  
2.5  
A
T
A
= 25°C  
= 0°C  
0.7  
0.6  
T
A
= 125°C  
T
A
T
A
T
A
= –40°C  
= –40°C  
0.5  
0.4  
0.3  
T
A
= 0°C  
T
= 125°C  
A
2.4  
2.3  
T
= 25°C  
= 70°C  
A
T
A
2.2  
0.2  
0.1  
0.0  
2.1  
2.0  
0
50  
100  
150  
200  
250  
300  
0
50  
100  
150  
200  
250  
300  
I
– High-Level Output Current – mA  
I
– Low-Level Output Current – mA  
OH  
OL  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
Copyright 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...21

中文翻译

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