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TLV2774MDREP PDF预览

TLV2774MDREP

更新时间： 2024-09-29 12:47:11
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德州仪器 - TI 运算放大器放大器电路光电二极管输出元件PC
页数 文件大小 规格书
40页 1087K
描述
FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

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TLV2774MDREP 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：GREEN, PLASTIC, MS-012AB, SOIC-14针数：14
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：6 weeks
风险等级：1.19Samacsys Confidence：
Samacsys Status：ReleasedSamacsys PartID：607366
Samacsys Pin Count：14Samacsys Part Category：Integrated Circuit
Samacsys Package Category：OtherSamacsys Footprint Name：SOIC127P600X175-14N
Samacsys Released Date：2017-01-12 12:59:53Is Samacsys：N
放大器类型：OPERATIONAL AMPLIFIER架构：VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)：0.00006 µA25C 时的最大偏置电流 (IIB)：0.00006 µA
最小共模抑制比：60 dB标称共模抑制比：96 dB
频率补偿：YES最大输入失调电流 (IIO)：0.00006 µA
最大输入失调电压：2500 µVJESD-30 代码：R-PDSO-G14
JESD-609代码：e4长度：8.65 mm
低-偏置：YES低-失调：NO
微功率：NO湿度敏感等级：1
功能数量：4端子数量：14
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装等效代码：SOP16,.25封装形状：RECTANGULAR
封装形式：SMALL OUTLINE包装方法：TR
峰值回流温度（摄氏度）：260功率：NO
电源：2.7/5 V可编程功率：NO
认证状态：Not Qualified座面最大高度：1.75 mm
最小摆率：4.7 V/us标称压摆率：10.5 V/us
子类别：Operational Amplifier最大压摆率：2 mA
供电电压上限：7 V标称供电电压 (Vsup)：2.7 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
标称均一增益带宽：5100 kHz最小电压增益：13000
宽带：NO宽度：3.91 mm
Base Number Matches：1

TLV2774MDREP 数据手册

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SGLS317A − OCTOBER 2005 − REVISED SEPTEMBER 2007  
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
D
D
D
Rail-to-Rail Output  
360 µV Input Offset Voltage  
Low Distortion Driving 600-Ω  
0.005% THD+N  
D
D
D
D
D
Extended Temperature Performance of  
−55°C to 125°C  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
D
D
D
D
D
1 mA Supply Current (Per Channel)  
17 nV/√Hz Input Noise Voltage  
2 pA Input Bias Current  
Enhanced Product-Change Notification  
Characterized From T = −55°C to 125°C  
Micropower Shutdown Mode . . . I  
A
(1)  
Qualification Pedigree  
< 1 µA  
DD  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
†
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
D
D
D
High Slew Rate . . . 10.5 V/µs Typ  
High-Gain Bandwidth . . . 5.1 MHz Typ  
Supply Voltage Range 2.5 V to 5.5 V  
description  
The TLV277x CMOS operational amplifier family combines high slew rate and bandwidth, rail-to-rail output  
swing, high output drive, and excellent dc precision. The device provides 10.5 V/µs of slew rate and 5.1 MHz  
of bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher  
than current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive make these  
devices a good choice for driving the analog input or reference of analog-to-digital converters (ADCs) . These  
devices also have low distortion while driving a 600-Ω load for use in telecom systems.  
These amplifiers have a 360-µV input offset voltage, a 17 nV/√Hz input noise voltage, and a 2-pA input bias  
current for measurement, medical, and industrial applications. The TLV277x family is also specified across an  
extended temperature range (−55°C to 125°C), making it useful for military and avionics systems.  
These devices operate from a 2.5-V to 5.5-V single supply voltage and are characterized at 2.7 V and 5 V. The  
single-supply operation and low power consumption make these devices a good solution for portable  
applications. The following table lists the packages available.  
FAMILY PACKAGE TABLE  
PACKAGE  
NUMBER  
UNIVERSAL  
TYPES  
DEVICE  
SHUTDOWN  
OF  
CHANNELS  
EVM BOARD  
SOIC TSSOP  
TLV2770  
TLV2771  
TLV2772  
TLV2773  
TLV2774  
TLV2775  
1
1
2
2
4
4
8
8
—
—
8
Yes  
—
See the EVM  
Selection Guide  
(SLOU060)  
8
—
14  
14  
16  
—
14  
16  
Yes  
—
Yes  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
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ꢐ
Copyright 2007 Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...40

中文翻译

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TLV2774MDREP 替代型号

型号 品牌 替代类型 描述 数据表
V62/06607-03YE TI

完全替代

 FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

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