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TLV2772 PDF预览

TLV2772

更新时间: 2024-11-29 21:55:47
品牌 Logo 应用领域
德州仪器 - TI 运算放大器输出元件
页数 文件大小 规格书
32页 635K
描述
2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT DUAL OPERATIONAL AMPLIFIERS

TLV2772 数据手册

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TLV2772, TLV2772A, TLV2772Y  
2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT  
DUAL OPERATIONAL AMPLIFIERS  
SLOS209 – JANUARY 1998  
D OR P PACKAGE  
(TOP VIEW)  
High Slew Rate . . . 10.5 V/µs Typ  
High-Gain Bandwidth . . . 5.1 MHz Typ  
Supply Voltage Range 2.7 V to 5 V  
Rail-to-Rail Output  
1OUT  
1IN–  
V
+
DD  
1
2
3
4
8
7
6
5
2OUT  
2IN–  
2IN+  
1IN+  
360 µV Input Offset Voltage  
V
/GND  
DD  
Low Distortion Driving 600-Ω  
0.005% THD+N  
DGK PACKAGE  
(TOP VIEW)  
1 mA Supply Current (Per Channel)  
17 nV/Hz Input Noise Voltage  
2 pA Input Bias Current  
1
2
3
4
8
7
6
5
1OUT  
1IN–  
1IN+  
V
+
DD  
2OUT  
2IN–  
2IN+  
Characterized from T = 40°C to 125°C  
A
Available in MSOP (DGK) Package  
V
/GND  
DD  
description  
TheTLV2772dualCMOSoperationalamplifiercombineshighslewrateandbandwidth, rail-to-railoutputswing,  
high output drive and excellent dc precision. The device provides 10.5 V/µs of slew rate and 5.1 MHz of  
bandwidth while only consuming 1 mA of supply current per channel. This ac performance is much higher than  
current competitive CMOS amplifiers. The rail-to-rail output swing and high output drive makes this device a  
good choice for driving the analog input or reference of analog-to-digital converters. The device also has low  
distortion while driving a 600-load for use in telecom systems.  
17 nV Hz  
The amplifier has a 360 µV input offset voltage, a  
input noise voltage, and a 2 pA input bias current  
for measurement, medical, and industrial applications. The TLV2772 is also specified across an extended  
temperature range (40°C to 125°C) making it useful for automotive systems.  
The device operates from a 2.2 V to 5.5 V single supply voltage and is characterized at 2.7 V and 5 V. The single  
supply operation and low power consumption make this device a good solution for portable applications. It is  
available in an 8-pin PDIP, SOIC and ultra-low profile MSOP package.  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP FORM  
(Y)  
T
A
V
IO  
max AT 25°C  
SMALL OUTLINE  
(D)  
MSOP  
(DGK)  
PLASTIC DIP  
(P)  
0°C to 70°C  
2.5  
TLV2772CD  
TLV2772CDGK  
TLV2772CP  
TLV2772Y  
2.5  
1.6  
TLV2772ID  
TLV2772AID  
TLV2772IDGK  
TLV2772AIDGK  
TLV2772IP  
TLV2772AIP  
40°C to 125°C  
The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLV2772CDR).  
Chip forms are tested at T = 25°C only.  
A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
This document contains information on products in more than one phase  
of development. The status of each device is indicated on the page(s)  
specifying its electrical characteristics.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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型号 品牌 替代类型 描述 数据表
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