是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SSOP |
包装说明: | TSSOP, | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.83 | 放大器类型: | OPERATIONAL AMPLIFIER |
架构: | VOLTAGE-FEEDBACK | 最大平均偏置电流 (IIB): | 0.000015 µA |
25C 时的最大偏置电流 (IIB): | 0.000015 µA | 最小共模抑制比: | 55 dB |
标称共模抑制比: | 76 dB | 频率补偿: | YES |
最大输入失调电流 (IIO): | 0.000015 µA | 最大输入失调电压: | 3500 µV |
JESD-30 代码: | S-PDSO-G8 | JESD-609代码: | e4 |
长度: | 3 mm | 低-偏置: | YES |
低-失调: | NO | 微功率: | YES |
湿度敏感等级: | 1 | 功能数量: | 2 |
端子数量: | 8 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | TSSOP | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 包装方法: | TUBE |
峰值回流温度(摄氏度): | 260 | 功率: | NO |
可编程功率: | NO | 座面最大高度: | 1.1 mm |
最小摆率: | 0.07 V/us | 标称压摆率: | 0.22 V/us |
子类别: | Operational Amplifier | 最大压摆率: | 0.056 mA |
供电电压上限: | 4 V | 标称供电电压 (Vsup): | 2.4 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
标称均一增益带宽: | 500 kHz | 最小电压增益: | 20000 |
宽带: | NO | 宽度: | 3 mm |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TLV2762CDGKR | TI |
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TLV2762CDGKR | TI |
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