TLV2731

更新时间： 2024-09-12 22:37:07

品牌	Logo	应用领域
德州仪器 - TI		运算放大器
页数	文件大小	规格书
28页	631K
描述
Advanced LinCMOSE RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

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TLV2731 数据手册

TLV2731, TLV2731Y

Advanced LinCMOS RAIL-TO-RAIL

LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

SLOS198 – AUGUST 1997

DBV PACKAGE

(TOP VIEW)

Output Swing Includes Both Supply Rails

Low Noise . . . 15 nV/√Hz Typ at f = 1 kHz

Low Input Bias Current . . . 1 pA Typ

OUT

DD–

/GND

Fully Specified for Single-Supply 3-V and

5-V Operation

DD+

Common-Mode Input Voltage Range

Includes Negative Rail

IN+

IN–

High Gain Bandwidth . . . 2 MHz at

= 5 V with 600 Ω Load

High Slew Rate . . . 1.6 V/µs at V

= 5 V

Wide Supply Voltage Range

2.7 V to 10 V

Macromodel Included

description

The TLV2731 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of

bandwidth and 1.6 V/µs of slew rate for applications requiring good ac performance. The device exhibits

rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2731

is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.

The TLV2731, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of

high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels

combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing

applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great

choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-Ω loads for

telecom applications.

With a total area of 5.6mm , the SOT-23 package only requires one-third the board space of the standard 8-pin

SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal

source, minimizing noise pick-up from long PCB traces.

AVAILABLE OPTIONS

CHIP

FORM

(Y)

PACKAGED DEVICES

‡

max AT 25°C

SYMBOL

†

SOT-23 (DBV)

0°C to 70°C

3 mV

TLV2731CDBV

TLV2731IDBV

VALC

VALI

TLV2731Y

–40°C to 85°C

†

‡

The DBV package available in tape and reel only.

Chip forms are tested at T = 25°C only.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Advanced LinCMOS is a trademark of Texas Instruments Incorporated.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

12 3 4 5 6 7...28

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与TLV2731相关器件

型号	品牌	获取价格	描述	数据表
TLV2731CDBV	TI	获取价格	Advanced LinCMOSE RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
TLV2731CDBVR	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL
TLV2731CDBVRG4	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL
TLV2731CDBVT	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL
TLV2731CDBVTG4	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL
TLV2731IDBV	TI	获取价格	Advanced LinCMOSE RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
TLV2731IDBVR	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL
TLV2731IDBVRG4	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL
TLV2731IDBVT	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL
TLV2731IDBVTG4	TI	获取价格	Advanced LinCMOS RAIL-TO-RAIL

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