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TLV2721

更新时间： 2024-11-22 22:37:07
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德州仪器 - TI 运算放大器
页数 文件大小 规格书
28页 580K
描述
Advanced LinCMOSE RAIL-TO-RAIL VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

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TLV2721 数据手册

 浏览型号TLV2721的Datasheet PDF文件第2页浏览型号TLV2721的Datasheet PDF文件第3页浏览型号TLV2721的Datasheet PDF文件第4页浏览型号TLV2721的Datasheet PDF文件第5页浏览型号TLV2721的Datasheet PDF文件第6页浏览型号TLV2721的Datasheet PDF文件第7页 
TLV2721, TLV2721Y  
Advanced LinCMOS RAIL-TO-RAIL  
VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS  
SLOS197 – AUGUST1997  
DBV PACKAGE  
(TOP VIEW)  
Output Swing Includes Both Supply Rails  
Low Noise . . . 19 nV/√Hz Typ at f = 1 kHz  
Low Input Bias Current . . . 1 pA Typ  
OUT  
1
2
3
5
4
V
/GND  
DD–  
Fully Specified for Single-Supply 3-V and  
5-V Operation  
V
DD+  
Very Low Power . . . 110 µA Typ  
IN+  
IN–  
Common-Mode Input Voltage Range  
Includes Negative Rail  
Wide Supply Voltage Range  
2.7 V to 10 V  
Macromodel Included  
description  
The TLV2721 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a  
compromise between the ac performance and output drive of the TLV2731 and the micropower TLV2711.  
It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications. The device  
exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The  
TLV2721 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.  
The TLV2721, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for  
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels  
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing  
applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great  
choice when interfacing with analog-to-digital converters (ADCs).  
2
With a total area of 5.6mm , the SOT-23 package only requires one third the board space of the standard 8-pin  
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal  
source, minimizing noise pick-up from long PCB traces.  
AVAILABLE OPTIONS  
CHIP  
FORM  
(Y)  
PACKAGED DEVICES  
‡
T
A
V
IO  
max AT 25°C  
SYMBOL  
†
SOT-23 (DBV)  
0°C to 70°C  
3 mV  
3 mV  
TLV2721CDBV  
TLV2721IDBV  
VAKC  
VAKI  
TLV2721Y  
–40°C to 85°C  
†
‡
The DBV package available in tape and reel only.  
Chip forms are tested at T = 25°C only.  
A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...28

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