5秒后页面跳转
捷配首页

Datasheet > 放大器电路 > 运算放大器> TLV2362ID
TLV2362ID PDF预览

TLV2362ID

更新时间： 2024-10-31 22:19:31
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路光电二极管
页数 文件大小 规格书
17页 276K
描述
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS

阅读下载

中文翻译

获取价格

TLV2362ID 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：SOIC-8针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：1 week
风险等级：5.3Is Samacsys：N
放大器类型：OPERATIONAL AMPLIFIER架构：VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)：0.25 µA25C 时的最大偏置电流 (IIB)：0.15 µA
最小共模抑制比：85 dB标称共模抑制比：60 dB
频率补偿：YES最大输入失调电流 (IIO)：0.1 µA
最大输入失调电压：6000 µVJESD-30 代码：R-PDSO-G8
JESD-609代码：e4长度：4.9 mm
低-偏置：NO低-失调：NO
微功率：NO湿度敏感等级：1
负供电电压上限：-3.5 V标称负供电电压 (Vsup)：-1.5 V
功能数量：2端子数量：8
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装等效代码：SOP8,.25封装形状：RECTANGULAR
封装形式：SMALL OUTLINE包装方法：TUBE
峰值回流温度（摄氏度）：260功率：NO
电源：+-1.5/+-2.5 V可编程功率：NO
认证状态：Not Qualified座面最大高度：1.75 mm
标称压摆率：3 V/us子类别：Operational Amplifier
最大压摆率：2.5 mA供电电压上限：3.5 V
标称供电电压 (Vsup)：1.5 V表面贴装：YES
技术：BIPOLAR温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED标称均一增益带宽：7000 kHz
最小电压增益：1000宽带：NO
宽度：3.9 mmBase Number Matches：1

TLV2362ID 数据手册

 浏览型号TLV2362ID的Datasheet PDF文件第2页浏览型号TLV2362ID的Datasheet PDF文件第3页浏览型号TLV2362ID的Datasheet PDF文件第4页浏览型号TLV2362ID的Datasheet PDF文件第5页浏览型号TLV2362ID的Datasheet PDF文件第6页浏览型号TLV2362ID的Datasheet PDF文件第7页 
TLV2361, TLV2361Y, TLV2362, TLV2362Y  
HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS  
SLOS195B – FEBRUARY 1997 – REVISED OCTOBER 1998  
TLV2361 . . . DBV PACKAGE  
(TOP VIEW)  
Low Supply-Voltage  
Operation . . . V = ±1 V Min  
CC  
Wide Bandwidth . . . 7 MHz Typ at  
± = ±2.5 V  
5
1
2
3
IN+  
V
+
CC  
V
CC  
High Slew Rate . . . 3 V/µs Typ at  
± = ±2.5 V  
V
–
CC  
V
CC  
IN–  
Wide Output Voltage Swing . . . ±2.4 V Typ  
at V ± = ±2.5 V, R = 10 kΩ  
OUT  
4
CC  
L
Low Noise . . . 8 nV/√Hz Typ at f = 1 kHz  
TLV2362 . . . D, P, OR PW PACKAGE  
(TOP VIEW)  
Package Options Include SOT-23 (DBV)  
Package for the TLV2361 and Plastic  
Small-Outline (D), Thin Shrink  
Small-Outline (PW), and Dual-In-Line (P)  
Packages for the TLV2362  
1OUT  
1IN–  
1IN+  
V
+
CC  
1
2
3
4
8
7
6
5
2OUT  
2IN–  
2IN+  
V
–
CC  
description  
The TLV236x devices are high-performance dual operational amplifiers built using an original Texas  
Instruments bipolar process. These devices can be operated at a very low supply voltage (±1 V), while  
maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal  
conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other  
general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With  
their low distortion and low-noise performance, these devices are well suited for audio applications.  
The C-suffix devices are characterized for operation from 0°C to 70°C and the I-suffix devices are characterized  
for operation from –40°C to 85°C.  
TLV2361 AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP  
‡
T
A
SYMBOL  
FORM  
(Y)  
SOT-23  
†
(DBV)  
0°C to 70°C  
TLV2361CDBV  
TLV2361IDBV  
VAAC  
VAAI  
TLV2361Y  
–40°C to 85°C  
†
‡
The DBV packages are only available taped and reeled.  
Chip forms are specified for operation at 25°C only.  
TLV2362 AVAILABLE OPTIONS  
PACKAGED DEVICES  
§
CHIP  
FORM  
(Y)  
‡
TSSOP  
(PW)  
T
A
SMALL OUTLINE  
(D)  
PLASTIC DIP  
(P)  
–20°C to 85°C  
TLV2362ID  
TLV2362IP  
TLV2362IPWR  
TLV2362Y  
‡
§
Chip forms are specified for operation at 25°C only.  
The D packages are available taped and reeled. Add an R to the package suffix (e.g., TLV2362IDR).  
The PW packages are available left-ended taped and reeled only, (e.g., TLV2362IPWR).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...17

中文翻译

下载PDF

TLV2362ID 替代型号

型号 品牌 替代类型 描述 数据表
TLV2362IDRG4 TI

类似代替

 Dual High-Performance, Low-Voltage Operational Amplifier 8-SOIC -40 to 85
TLV2362IDRE4 TI

类似代替

 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IDR TI

类似代替

 HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS

与TLV2362ID相关器件

型号 品牌 获取价格 描述 数据表
TLV2362IDE4 TI

获取价格

 		HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IDGKR TI

获取价格

 		HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IDGKRG4 TI

获取价格

 		HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IDR TI

获取价格

 		HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IDRE4 TI

获取价格

 		HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IDRG4 TI

获取价格

 		Dual High-Performance, Low-Voltage Operational Amplifier 8-SOIC -40 to 85
TLV2362IP TI

获取价格

 		HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IPE4 TI

获取价格

 		HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TLV2362IPS TI

获取价格

 		暂无描述
TLV2362IPSE4 TI

获取价格

 		DUAL OP-AMP, 7500uV OFFSET-MAX, 6MHz BAND WIDTH, PDSO8, PLASTIC, DIP-8

与TLV2362ID相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证